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1)  acid electroless Ni-P plating
酸性化学镀Ni-P
2)  electroless Ni-P plating
化学镀Ni-P
1.
Study of electroless Ni-P plating on the diamond;
金刚石表面化学镀Ni-P的研究
2.
The low temperature bonding between 95%Al2O3 ceramics and 45 steel was realized through first electroless Ni-P plating on Al2O3ceramic blocks and then soldering them to steel blocks with a low melting point filler metal of 63Sn-34Pb-2Ag-1Bi alloy.
采用化学镀Ni-P膜法金属化Al2O3陶瓷,并用63Sn-34Pb-2Ag-1Bi钎料膏实现了95%Al2O3陶瓷与45钢之间的低温钎焊。
3)  Ni-P electroless plating
Ni-P化学镀
1.
The reaction mechanisms of Ni-P electroless plating and Ni-P-SiC composite electroless plating are researched, and the reaction thermodynamics are analyzed.
本文论述了Ni-P化学镀和Ni-P-SiC复合化学镀的反应机理,并对化学镀反应的热力学和动力学进行了分析。
2.
Ni-P electroless plating was adopted to encapsulate the as-received CaF2 in the preparation of precursor mixed powders of NiCr-Cr3C2-40%CaF2(wt.
%)复合合金粉末为原料,采用Nd:YAG激光熔覆技术,在γ-TiAl合金基体表面成功制备出了高温自润滑耐磨复合材料涂层,在复合粉体准备时,采用Ni-P化学镀包覆原始CaF2颗粒,以减少其在激光熔覆过程中的分解、蒸发和上浮。
4)  electroless plating Ni-P
化学镀Ni-P
1.
In order to improve the deposition rate and anti-corrosion properties of electroless plating Ni-P on aluminum,effects of stabilizing agents and surface active agents on the deposition rate and corrosion resistance of electroless plating Ni-P were studied.
为了改善铝基体上化学镀Ni-P存在的镀速慢、镀层腐蚀性能差等问题,研究了稳定剂和表面活性剂对铝化学镀Ni-P镀层的沉积速度、硬度、孔隙率、结合力、耐蚀性、腐蚀电位、表面形貌等性能的影响。
2.
In order to improve the corrosion resistance of ZL101A alloy, the electroless plating Ni-P coatings with and without electroplating Cu layer were investigated by potentiodynamic polarization, salt spary test, SEM, microhardness meter.
为提高ZL101A合金的耐蚀性能,可直接化学镀Ni-P或电镀Cu后化学镀Ni-P在其表面施加镀层。
5)  electroless Ni-P
化学镀Ni-P
1.
In order to improve the corrosion resistance of A356 alloy,electroless Ni-P coatings were plated on the A356 alloy with and without a Ni pre-electroplating and then their corrsion performance was investigated by potentiodynamic polarization,salt spary test,SEM and microhardness.
用直接化学镀Ni-P和先电镀Ni后化学镀Ni-P两种方法在A356合金表面施加镀层。
2.
Electroless Ni-P has been widely used in the microelectronic packing in the recent years because of the better solderability and diffusion barrier.
化学镀Ni-P是一种优异的钎焊阻挡层材料,具有良好的可焊性,近年来在微电子封装工业中得到了广泛的应用。
6)  electroless Ni–P plating
化学镀Ni–P
1.
The surface of eccentric wheel was plated using electroless Ni–P plating and the process flow and formulation were presented.
采用化学镀Ni–P工艺对其表面进行镀覆处理,给出了工艺流程和规范,讨论了前处理工艺、零件装载量及搅拌频率、镀层中P含量对镀层性能的影响,确定了最佳工艺条件:(6±0。
补充资料:酸性镀铜光亮剂(N)
CAS:96-45-7
分子式:C3H6N2S
分子质量:102.16
熔点:198-204℃
中文名称:2-咪唑烷硫酮;促进剂NA-22;亚乙基硫脲;2-硫醇基咪唑啉;酸性镀铜光亮剂(N);乙烯硫脲;乙撑硫脲;四氢咪唑-2-硫酮;促进剂NA-2;酸性镀铜光亮剂N

英文名称:2-Imidazolidine thione;Accelerator NA-22;Ethylene thiourea;1,3-ethylene-2-thiourea;1,3-ethylenethiourea;2-imadazoline-2-thiol;2-imidazolidinethione;2-imidazoline-2-thiol;2-mercapto-2-imidazoline;2-mercaptoimidazoline

性状描述:白色针状结晶。熔点203-204℃。易溶于热水。90℃时,100毫升水中可溶本品44克,但在30℃水中只溶2克。溶于醇;乙二醇和吡啶,不溶于醚;苯;氯仿和石油醚。

生产方法:在搪玻璃反应锅内,加入水和乙二胺,降温20℃,加入二硫化碳,控制在35-40℃,反应4小时,升温回收二硫化碳,生成乙烯基二硫代氨基甲酸盐。将乙烯基二硫代氨基甲酸盐冷却至50℃以下,加入盐酸,升温即放出硫化氢,环化生成乙烯硫脲。环化反应时,也可用乙酸代替盐酸进行反应,得到的粗制乙烯硫脲用沸水溶解,过滤,冷却析出结晶,经脱水干燥;粉碎而得成品。(公斤/吨)乙二胺(70%) 740二硫化碳(95%) 1250

用途:本品为咪唑啉类硫化促进剂,可用于氯丁橡胶;氯醇橡胶;氯化聚乙烯等,特别适合于作非硫化体系的氯丁胺的安合促进剂。能常在100-500℃下,选用适当的配合体系,就可进行快速的最佳硫化,且操全安全。其硫化制品抗张强度高,永久压缩变形小,用于W型(即54-1型氯丁橡胶)的非硫化体系进效果显著。它通常与氧化锌和氧化镁一起配合使用,主要用于工业制品;被覆电线;鞋衣等氯丁橡胶制品。乙烯硫脲是硫酸铜的辅助光亮剂。本品也用作精细化学的中间体,用于制造抗氧剂;杀虫剂;杀真菌剂;染料;药物和合成树脂。
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