2) soft-contact mold
软接触结晶器
1.
Numerical simulation on the distribution of magnetic flux density in a electromagnetic soft-contact mold;
电磁软接触结晶器磁感应强度分布的数值模拟
2.
Research on the structure parameters of electromagnetic soft-contact mold for industrial field test;
工业实验用电磁软接触结晶器结构参数研究
3.
The development of electromagnetic continuous casting process with soft-contact mold was reviewed from four aspects: the distribution of electromagnetic field in the mold and the design of the mold,the mechanism of improving the surface qualities and meniscus behavior in electromagnetic field and the electromagnetic field type′s development in the process.
从磁场分布和结晶器设计、磁场对铸坯表面质量改善的机理、电磁场作用下结晶器内弯月面的行为、磁场施加方式的演变等几个方面,综合论述了软接触结晶器电磁连铸技术的发展现状,并指出了该技术未来发展过程中值得注意的几个方面。
3) soft contact mold
软接触结晶器
1.
Using non staggered BFC grid system, the effect of electromagnetic field on molten flow pattern in soft contact mold was simulated.
采用非交错网格和适体坐标方法数值模拟了电磁场对软接触结晶器内钢液流动的影响规律。
2.
The electromagnetic continuous casting processing with soft contact mold is a novel technique for improving quality of billet by applying electromagnetic field in mold.
介绍了软接触结晶器电磁连铸技术的基本原理 ,评述了该技术的发展过程 ,分析了在该技术研究中尚需解决的问题。
3.
The three dimension alternative electromagnetic field of square billet soft contact mold was simulated by using the Galerkin finite element method.
运用Galerkin有限元法对方坯软接触结晶器内三维交变磁场进行了数值模拟·计算表明 :磁场主要集中在线圈和结晶器附近 ,磁感应强度在靠近线圈中心位置附近出现最大值 ,随后迅速衰减 ,但在结晶器出口处磁场又有所增强 ;空载结晶器内部的磁场分布比较均匀 ;切缝能增强结晶器内部磁场 ,减小结晶器铜壁的屏蔽 ;磁压力在周向上分布具有不均匀性 ,易造成铸坯凹
4) electromagnetic soft-contact
电磁软接触
1.
Study on electromagnetic casting properties of electromagnetic soft-contact mould;
电磁软接触结晶器电磁冶金特性研究
2.
The electromagnetic soft-contact continuous casting(EMCC) technique is a novel technique.
电磁软接触连铸技术是一门新兴技术。
5) electromagnetic soft-contacting
电磁软接触
1.
Structure of electromagnetic soft-contacting continuous casting mold in commercial scale experiment;
电磁软接触连铸工业实验用结晶器结构
2.
Aiming at the process of electromagnetic soft-contacting continuous casting,a three-dimensional finite element model of electromagnetic field and temperature field was developed to investigate the influences of power frequency,current intensity,heat flux between casting billet and copper mould and heat conductivity of thermal insulation material on the temperature field.
针对电磁软接触连铸过程,建立了结晶器三维电磁场及温度场模型,研究了电流、电源频率、铸坯与结晶器间热流密度以及绝缘材料导热性能对温度场的影响。
6) MCtt
电磁接触器
补充资料：二次再结晶(见再结晶晶粒长大)
二次再结晶(见再结晶晶粒长大)
secondary recrystallization
erCI 201」le」Ing二次再结晶(seeondary reerystallization) 见再结晶晶杠长大。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条