1)  tri (4-hydroxyphenyl) methane
					
	
					
				
				
	
					
				三酚基甲烷
				1.
					The article mainly studies the syntheses of tri (4-hydroxyphenyl) methane with phenol and parahydroxy benzaldehyde, and tri (4-hydroxyphenyl) methane glycidyl ether with the tri (4-hydroxyphenyl) methane and epoxy chloropropane.
						
						三酚基甲烷三缩水甘油醚是一种耐高温环氧树脂,具有良好的韧性和加工性能。
					2.
					Tri (4-hydroxyphenyl) methane and epoxy chloropropane are synthesized to produce the condensed tri (4-hydroxyphenyl) methane glycidyl ether in the presence of some catalysts.
						
						 主要研究以三酚基甲烷和环氧氯丙烷(ECH)为原材料,在催化剂作用下缩合制备三酚基甲烷三缩水甘油醚。
					
					2)  TPGEM
					
	
					
				
				
	
					
				三酚基甲烷环氧树脂
			
					3)  trimethylolphenol
					
	
					
				
				
	
					
				三 甲基酚
			
					4)  bi-phenolic methane
					
	
					
				
				
	
					
				二酚基甲烷
				1.
					Through orthogonal design experiments, the effective regularities of synthetic condition s on the yield rate and bi-nucleus ratio of bi-phenolic methane are discussed .
						
						利用正交实验,研究了苯酚和甲醛在酸性催化剂的作用下合成二酚基甲烷的反应。
					
					5)  trimethyl-methane
					
	
					
				
				
	
					
				三甲基甲烷
			
					6)  tri (4-hydroxyphenyl) methane glycidyl ether
					
	
					
				
				
	
					
				三酚基甲烷三缩水甘油醚
				1.
					The article mainly studies the syntheses of tri (4-hydroxyphenyl) methane with phenol and parahydroxy benzaldehyde, and tri (4-hydroxyphenyl) methane glycidyl ether with the tri (4-hydroxyphenyl) methane and epoxy chloropropane.
						
						三酚基甲烷三缩水甘油醚是一种耐高温环氧树脂,具有良好的韧性和加工性能。
					补充资料:三酚基甲烷三缩水甘油醚
		分子式:
CAS号:
性质:又称三酚基甲烷三缩水甘油醚(triphenol methane triglycityl ether)或三缩水甘油醚三苯基甲烷(triglycidyl ether triphenyl methane)。俗称三酚基甲烷环氧树脂(triphenol methane epoxy resin)。含三酚基甲烷的缩水甘油醚树脂。环氧当量198g/eq,软化温度88℃。固化物热变形温度209℃;弯曲强度100MPa。由三酚基甲烷与环氧氯丙烷反应制得。单独或与双酚A环氧树脂混合使用。可用作耐热胶黏剂、复合材料、封装料、模塑料、粉末涂料等。用于计算机等的印刷线路板,电子元器件封装和机电等行业。
		
		CAS号:
性质:又称三酚基甲烷三缩水甘油醚(triphenol methane triglycityl ether)或三缩水甘油醚三苯基甲烷(triglycidyl ether triphenyl methane)。俗称三酚基甲烷环氧树脂(triphenol methane epoxy resin)。含三酚基甲烷的缩水甘油醚树脂。环氧当量198g/eq,软化温度88℃。固化物热变形温度209℃;弯曲强度100MPa。由三酚基甲烷与环氧氯丙烷反应制得。单独或与双酚A环氧树脂混合使用。可用作耐热胶黏剂、复合材料、封装料、模塑料、粉末涂料等。用于计算机等的印刷线路板,电子元器件封装和机电等行业。
说明:补充资料仅用于学习参考,请勿用于其它任何用途。
	参考词条