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1)  Scrap particle board
废旧刨在板
2)  waste particleboard
废旧刨花板
1.
Research on technology of water-thermal treatment for waste particleboard;
废旧刨花板水煮技术研究
2.
Thes of this article made a two-step experiment on waste particleboards in order to investigate an effective method and the number of possible times waste particleboards could be recycled.
探讨利用废旧刨花板循环制造刨花板的技术。
3.
This article is about the recycle of waste particleboard.
本论文主要研究利用废旧刨花板制造刨花板的过程中,备料工艺及热压工艺对制得的刨花板各项性能的影响。
3)  waste particleboard
废弃刨花板
1.
For manufacturing satisfactory particleboards with regenerated particles from recycled waste particleboards as raw materials,an orthogonal hot-pressing experiment was conducted to investigate the effects of the proportion of regenerated particles in wood furnish,resin content,and press time on the MOR and IB of the boards.
以废弃刨花板再生刨花为原料,用正交试验法压制再生刨花板,研究再生刨花的使用比例、施胶量、热压时间对再生刨花板静曲强度和内结合强度的影响,并提出了生产再生刨花板的最佳热压工艺。
4)  recycled wood-based panel
废旧人造板
5)  waste printed circuit boards
废旧电路板
1.
Study on phenol-formaldehyde resin prepared from waste printed circuit boards;
废旧电路板制备的酚醛树脂的研究
2.
Study on compositions of pyrolystic tar from waste printed circuit boards mixed with calcium carbonate
碳酸钙存在下废旧电路板热解油的组成特征
6)  waste circuit board
废旧电路板
1.
The mechanism and features of microwave heating and microwave technology applied to radioactive waste, waste circuit board, sludge, waste tyre are discussed, applicable prospect of microwave technology application in waste processing is also given.
综述了微波在废物处理中的应用,主要介绍了微波加热的机理及特点,微波在处理放射性废物、废旧电路板、污泥、医疗垃圾、废轮胎中的应用,展望了微波技术在废物处理中的应用前景。
2.
The recovery method of waste circuit board depends on the property of circuit board,so it is very important for choosing the processing technology which makes out the compose and content of various material in the waste circuit board from the qualitative and quantitative angle.
废旧电路板的回收方法依赖于电路板的性质,因此从定性和定量的角度确定废旧电路板上各种物质的组成和含量,对处理技术的选择非常重要。
补充资料:凹板印刷机用胶布板
分子式:
分子量:
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性质:用于高速轮转凹版印刷机的胶布板。供印刷报纸、杂志、图书等。与凸版印刷机用胶布板的装置位置相同,不与油墨直接接触,但作用不同,通过橡皮表层的弹力作用,将凹沟内的油墨吸到纸张上。印刷时所受的压力较大,胶层须较厚。

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