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1)  the reaction humidity
反应湿度
2)  reactive wetting
反应润湿
1.
This article is devoted to clarifying the mechanism of reactive wetting and summarizing the change of wetting force of Sn-based solder and the morphology of the interfacial structure by changing the type of alloying elements added to the solder,experimental temperature and metal coating on Cu substrate.
综述了通过改变添加的合金元素种类、温度和Cu基板上的金属镀层,Sn基钎料润湿力以及界面组织形态的变化,提出了在不同实验条件下Sn基钎料的反应润湿性能不同的观点。
3)  Wet method reaction
湿法反应
4)  wet reaction
湿反应
5)  humidity effect
湿度效应
1.
The humidity effect in the radon exhalation rate measurement by the method of the activated charcoal absorption—γspectrometry;
活性炭-γ谱法测量氡析出率的湿度效应研究
2.
Aging and humidity effects of optical surface deformation after deposition
镀膜元件面形变化的时间效应和湿度效应
3.
The humidity effect, namely the markedly positive correlation between stable isotopic ratio in precipitation and dew-point deficit in atmosphere %ΔT%-d, is put forward firstly and the relationship between {δ~{18}O} in precipitation and %ΔT%-d is analyzed in this paper for the Urumqi and Kunming Stations, which climatic characteristics are completely different.
提出了湿度效应的概念,即降水中稳定同位素比率与大气的温度露点差ΔTd存在显著的正相关关系。
6)  humid strain
湿度应变
补充资料:凝结湿度表(见露点湿度表)


凝结湿度表(见露点湿度表)


川呀j一e sh,d日biao凝结湿度表见露点湿度表。
说明:补充资料仅用于学习参考,请勿用于其它任何用途。
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