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1)  Co-Ag granular film
Co-Ag颗粒膜
2)  NiFeCo/Ag granular films
NiFeCo/Ag颗粒膜
3)  [FePt/Ag]n granular thin films
[FePt/Ag]n颗粒膜
4)  Co Al O insulating granular film
Co-Al-O颗粒薄膜
5)  Co Ta O granular films
Co-Ta-O颗粒膜
6)  Ag particles
Ag颗粒
1.
Effect of content of Ag particles on properties of SnCu based composite solder;
Ag颗粒含量对SnCu基复合钎料性能的影响
2.
The Cu6Sn5 intermetallic compound layer formed between the matrix and the counteract of Ag particles to creep behavior are the main reasons for the high creep resistance of the composite solder.
测定了不同应力和温度下Ag颗粒增强复合钎料及基体钎料63Sn37Pb钎焊接头蠕变寿命,分析了Ag颗粒增强复合钎料及基体钎料钎焊接头蠕变断裂机理。
补充资料:poly(bisphenol a-co-4-nitrophthalic anhy-dride-co
CAS:61128-46-9
分子式:(C31H20O8·C6H8N2)x
中文名称:5,5'-[(1-甲基亚乙基)双(4,1-亚苯氧基)]双-1,3-异苯并呋喃二酮与1,3-亚苯二胺的聚合物

英文名称:1,3-Isobenzofurandione, 5,5'-[(1-methylethylidene)bis(4,1-phenyleneoxy)]bis-, polymer with 1,3-benzenediamine

3-isobenzofurandione, 5,5'-[(1-methylethylidene)bis(4,1-phenyleneoxy)]bis- polymer with 1,3-benzenediamine

poly(bisphenol a-co-4-nitrophthalic anhy-dride-co

1,3-Isobenzofurandione,5,5'-[(1-methylethylidene)bis(4,1-phenyleneoxy)]bis-,polymer with 1,3-benzenediamine
说明:补充资料仅用于学习参考,请勿用于其它任何用途。
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