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1)  circuit board fabrication by laser micro cladding
激光微熔覆布线
2)  conductor fabrication by laser micro-cladding electronic pastes
激光微细熔覆柔性布线
3)  Laser micro-cladding
激光微熔覆
1.
A novel method to fabricate circuit board by laser micro-cladding technology was introduced in this paper.
介绍了一种利用激光制备线路板的新方法———激光微熔覆柔性布线技术 ,根据其原理和特点 ,设计并制造了相应的柔性布线系统 ,重点介绍了其软硬件组成。
4)  laser micro-cladding
激光微细熔覆
1.
Establishment and application of temperature field model in laser micro-cladding;
激光微细熔覆温度场模型的构建与应用
2.
Structure and properties of thick-film capacitors fabricated by laser micro-cladding rapid prototype;
激光微细熔覆快速原型制造的厚膜电容组织性能
3.
Fabrication of thick film resistors by laser micro-cladding resistor pastes;
用激光微细熔覆法直写电阻浆料制备厚膜电阻
5)  laser cladding
激光熔覆
1.
In-situ synthesis of Co_p/Cu composite coating by laser cladding;
激光熔覆原位合成Co_p/Cu复合涂层
2.
Research progress of laser cladding on the surface of magnesium alloys;
镁合金表面激光熔覆研究现状
3.
Influence of rare earths on Fe-based amorphous composite coatings by laser cladding;
稀土RE对激光熔覆Fe基非晶复合涂层的影响
6)  laser-cladding
激光熔覆
1.
Research of preventing the edges of tooth surface from collapsing in laser-cladding process;
齿面激光熔覆中的防边缘塌陷工艺研究
2.
Microstructure and Tribology Characteristics OF Laser-cladding Composite Ceramic Coating;
纳米复合陶瓷涂层激光熔覆后的组织与耐磨性能
3.
The WC–Ni–P composite coatings were made by laser-cladding on 1045 steel substrate.
利用激光熔覆技术在45钢表面制备了WC/Ni–P复合涂层,在Plint TE–66微磨料磨损试验机上进行了磨损试验,研究了不同稀土含量(CeO2)以及不同粒度WC粉末对涂层熔覆性能、硬度和磨损性能的影响。
补充资料:激光拉曼微区探针
分子式:
CAS号:

性质: 一种新的非破坏性微区分析技术。这种激光拉曼分子探针是用激光去激发样品,组成样品的不同组分产生不同频率的拉曼散射,以检测和鉴定各个组分,然后再经显微照相成像,给出各组分的分布图。它可以检测和研究在空气或控制气氛、液体或透明介质中的样品,样品用量少到10-12~10-15g级,能获得用电子或离子探针难于提供的有关分子化学键和分子结构方面的信息。

说明:补充资料仅用于学习参考,请勿用于其它任何用途。
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