1) solder interconnect
凸点互连
2) bump interconnect
凸点互联
1.
A reliable theoretic approach for bump pad design is discovered by studying bump interconnect pad design technology of 3D PCB assembly.
通过对板级立体组装凸点互联焊盘设计技术的研究,找到了凸点焊盘设计的一种可靠的理论途径,很好地解决了凸点互联中对位精度控制的问题,实现了板级立体组装的凸点互联工艺技术。
3) single-nod interconnection
单节点互连
4) interconnect IP node
互连IP节点
1.
Based on the research of multiple kinds of interconnect IP nodes,basic function of interconnect IP nodes can be designed with ASIP(Application Specific Instruction Processor) methodology in order to reuse these basic function for other interconnect nodes on which customization design for specific application based.
在研究多种互连IP节点功能的基础上,提出使用专用指令集处理器(ASIP)方法设计互连IP节点的基本功能集合,使得设计者可以实现对互连IP节点基本功能的复用,并添加定制设计以满足具体应用对互连IP节点的特定要求。
5) dual node interconnection
双节点互连
1.
This article generally introduces dual node interconnection protection mode adopted to improve intercon- necting node and trail of rings security while SDH rings widely deployed and mainly discusses the appli- cation of SNCP or MSP.
本文介绍在SDH环网大量采用的情况下,业务穿越两个甚至多个环网时,为提高环间互连节点和互连路径安全性所采用的双节点互连的保护方式。
补充资料：凸凸
1.高出貌。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条