1) electronic packaging
电封装
1.
Scanning thermal microscopic analysis of interface thermal conductivity of high thermal conductivity composites for electronic packaging;
高导热电封装复合材料界面热传导的扫描热显微镜分析
2) electronic packaging
电子封装
1.
Preparation of high volume fraction SiCp/Al composites for electronic packaging;
电子封装用高体积分数SiCp／Al复合材料的制备
2.
Study on properties of the environmental-friendly Sip/Al composites for electronic packaging applications;
环保型电子封装用Sip/Al复合材料性能研究
3.
Preparation of SiC particulate reinforced 356Al matrix composite for electronic packaging and its thermal expansion performance;
电子封装SiCp/356Al复合材料制备及热膨胀性能
3) printing of electronic packages
电路封装
1.
Uniform metal droplet stream can be used in powder metallurgy,uniform metal coatings,printing of electronic packages and rapid prototyping of metal structural components, which will enjoy good market prospect.
金属均匀液滴束流可应用于粉末冶金、材料合金薄层涂敷、电路封装和金属零件的快速成形等,具有广阔的市场应用前景。
5) electronic package
电子封装
1.
Based on ourselves' research activity and literature reports,evaluated and discussed the development trend of composite electronic package and substrate materials.
本文论述了陶瓷颗粒(纤维)增强聚合物基复合电子封装与基板材料体系和性能特点,介绍了复合基板材料的实验研究和理论研究进展情况,根据实验研究和文献报道并结合目前在微电子封装领域广泛应用的环氧塑封材料,对复合电子封装与基板材料的发展趋势进行了分析和评述。
2.
Development of advanced electronic package devices promoted the study on the reflow soldering.
先进电子封装器件的出现推动了再流焊方法和设备的研究。
3.
Solder joints functioned as mechanical, thermal and electrical interconnections between electronic packages and the printed circuit board (PCB), their failure can lead to critical malfunction of electronic products directly.
焊锡接点是电路板和电子封装之间传递电信号的媒介,同时还起到机械连接和支撑的作用,其破坏将直接导致电子产品失效。
6) electronics packaging
电子封装
1.
Several silk materials including gold silk, copper silk and aluminum silk used as conductor in wire bonding technology in electronics packaging materials were introduced.
介绍了电子封装材料中用于引线键合工艺的几种主要导电丝材料 ,包括金丝、铜丝和铝丝。
2.
System In Packaging SIP is a brand-new technology of electronics packaging.
系统封装(System In Packaging)是电子封装工艺的前沿技术。
补充资料：厂用电受电
厂用电受电
energizing of auxiliary power system
chongyongd一on sho一Jd一on厂用电受电(energizing of auxiliary powersystem)机组附属设备安装完毕后需通电试运行，所需厂用电源由外部供给，因此厂用电受电是调试工作开始的标志。 受电步骤新建电厂先由电力系统向变电站供电，再依次对高压起动/备用变压器、3~10kv厂用配电装置、厂用工作变压器及380V配电装置供电。扩建电厂因高压起动/备用变压器已经投人运行，故可利用它的电源对扩建的厂用配电装置等供电。 调试项目主要有:①用额定电压依次对空载线路、变电站母线、隔离开关、断瘩器、互感器、变压器及厂用配电装置等进行冲击合闸试验。有条件时.冲击合闸前应先进行递升加压试验。升压过程中注意检查各设备有无放电声及短路现象，发现问题及时处理后再进行升压。②检查三相电压应平衡，相序应正确，各段母线的相位彼此应一致。对配电装置供电时，有时会由于母线电容和与母线连接的电磁式电压互感器的电感相互作用而出现铁磁谐振，此时相电压升高，中性点明显位移。为消除谐振可在电压互感器的剩余电压绕组处并联电阻以去振。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条