2) semiconductor device
半导体设备
1.
The transient behavior of a semiconductor device of heat conduction is considered.
考虑热引导半导体设备中的传输行为 。
3) semiconductor equipment
半导体设备
1.
Application of GEM in semiconductor equipment;
半导体设备通讯标准GEM的应用
2.
Watch Dog of SCM System in Semiconductor Equipment;
应用于半导体设备的单片机系统中的“看门狗”
3.
The world semiconductor equipment market in the year 1999～2000, consist of the equipment investment, the photolithography equipment and the wiring shaping equipment are introduced.
介绍了１９９９ ～２０００ 年世界半导体设备市场，包括设备投资、光刻机和布线形成设备。
4) semiconductor manufacturing
半导体生产
1.
Improved hybrid rescheduling strategy for semiconductor manufacturing;
面向半导体生产的改进的混合重调度策略研究
2.
Review on Run-to-Run control in semiconductor manufacturing;
半导体生产过程的Run-to-Run控制技术综述
3.
Fuzzy-reasoning-based rescheduling strategy for semiconductor manufacturing
基于模糊推理的半导体生产重调度策略研究
5) semiconductor packaging equipment
半导体封装设备
1.
The Research of Data Communication in Semiconductor Packaging Equipment Based on TCP/IP;
基于TCP/IP的半导体封装设备之间数据通信的研究
2.
A general investigation on the application of the TCP/IP on semiconductor packaging equipment was introduced,based on it the issues of the TCP/IP protocol for network communication of semiconductor packaging equipments was solved.
介绍了利用WinSock进行网络编程的一般方法,并在此基础上解决了半导体封装设备使用TCP/IP协议进行网络实时通信的问题,实现了在服务器和客户机两端准确方便地实时发收文件和互相通信,并测试了发收不同大小文件所消耗的平均时间。
3.
Presenting a solution based on SECS standard interface,and the issues of the semiconductor packaging equipment communication was solved.
介绍了SECS标准的构成,提出了使用SECS标准接口解决半导体封装设备通信的问题,使所有设备全部都通过使用SECS标准接口连接到单元控制器及更高级别的MES和工厂计划信息系统。
补充资料：半导体导电性(见半导体的导电与电荷输运)
半导体导电性(见半导体的导电与电荷输运)
electrical conductivity of semiconductor
半导体导电性eleetr、ea一conou以，v:‘，_‘ 一J一“。，瓜米早伙鼓幕由乌教着给话_
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条