1) SnPb
SnPb焊料
2) eutectic SnPb solder
SnPb共晶焊料合金
3) SnPb solder joint
SnPb焊点
1.
Based on the unified viscoplastic Anand model, using of ANSYS software, thedistribution of the stress and strain in duplex SnPb solder joint during thermal cycling loading wasanalyzed.
基于SnPb焊料的统一粘塑性Anand本构模型,运用ANSYS有限元软件分析了球栅阵列封装中复合SnPb焊点在热循环过程中的应力、应变的分布,观察到SnPb焊料的蠕变行为和应力松弛现象,结果证明:外侧焊点经受的应力、应变范围比内侧焊点大;焊点的最高应力区域出现在Sn60Pb40焊料的最外缘处,最高应变区域出现在Pb90Sn10焊料与UBM层接触面的最上缘处。
4) SnPb soft solder
SnPb软钎料
1.
Aimed at the problem of fine solder in large power devices,the microstructure and components of SnPb soft solder of device are analyzed and the failure modes for polishing are documented.
针对大面积功率器件软钎料的失效问题,运用扫描电子显微镜(SEM)分析了SnPb软钎料的微观结构并运用能谱仪对其进行成分分析,找出了失效的主要原因:对软钎料进行刚玉抛光后,未能将残留在软钎料内的Al2O3成分完全去除,以至于器件的可焊性变差。
5) SnPb eutectic solder
SnPb共晶钎料
1.
Reaction kinetics between SnPb eutectic solder and Au/Ni/Cu pad during laser reflow;
激光加热条件下SnPb共晶钎料与Au/Ni/Cu焊盘界面反应动力学
2.
SnPb eutectic solder reflow on BGA pad metallized with Au/Ni to form solder bump with induction self excite heat under alternate electromagnetic radiation is performed, and impacts of induction self excite heat and solid state aging on interfacial reaction between SnPb eutectic solder and Au/Ni metallization are investigated.
进行了交变电磁辐射下附Au/Ni镀层BGA焊盘上SnPb共晶钎料球感应自发热重熔形成钎料凸台的实验,并分析了感应自发热重熔以及固态老化对SnPb共晶钎料与Au/Ni镀层焊盘界面反应的影响。
6) Solder and flux
焊料焊剂
补充资料：镉焊料
分子式：
CAS号：
性质：含82％镉、18％锌的合金。又称镉钎焊合金。工业上广泛用于焊接工艺。熔融法制备。
CAS号：
性质：含82％镉、18％锌的合金。又称镉钎焊合金。工业上广泛用于焊接工艺。熔融法制备。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条