2) Multi-Layer Ceramic (MLC),Low Temperature Cofired Ceramic (LTCC)
低温多层共烧
3) cofired
叠层共烧
1.
A novel zero-shrinkage-difference technique was introduced to eliminate the camber or cracks in cofired composites without the degradation,A sandwich structure of(Zn_(0.
以独特的零收缩差技术,制备了界面结合紧密,无翘曲变形、开裂等缺陷,可于900℃烧结的"三明治"结构叠层共烧体,其最佳介电性能为:ε_r=12,tanδ=9。
4) low temperature co-firing
低温共烧
1.
The composites were prepared by low temperature co-firing MgTiO3 microwave dielectric ceramic and Ni-Zn-Cu ferrite.
将MgTiO3微波介质陶瓷与Ni-Zn-Cu铁氧体进行低温共烧实验,研究了两种材料的低温烧结特性,结果表明,添加适量的Bi2O3能将复合材料的烧结温度降至900～920℃,并且使得烧结更加致密化。
2.
CaO-B2O3-SiO2 glass ceramics is characterized by both low temperature co-firing and excellent dielectric properties.
CaO-B2O3-SiO2微晶玻璃基板具有低的介电常数和与金属电极低温共烧的特性。
5) LTCC
低温共烧
1.
Research of LTCC technology of silver-base multilayer AlN ceramic substrates;
银基多层氮化铝陶瓷基板低温共烧的工艺研究
6) low temperature cofire
低温共烧
1.
A kind of low temperature cofired AIN multilayer substrates was introduced which consist of high thermal conductivity of AIN ceramics and metal W.
介绍了由高热导率AlN陶瓷与金属W制备的低温共烧多层AlN基片研究了以Dy2O3为主的添加系统对低温烧结AlN性能、显微结构的影响以及制备低温共烧基片的关键工艺，如排胶、烧成等，结果表明：以Dy2O3为主的添加系统可有效地降低烧结温度和去除AlN晶格氧在1650℃的氮中无压烧结4h，热导率达130W（m·K）-1;两步排胶法可以较好地解决W氧化及AlN晶粒表面吸附残余碳的问题；烧结时在1400～1650℃慢速升温，可减小共烷基片的翘曲和残余应
补充资料：层岩叠壑图
中国画。清代髡残作。纸本立轴。浅设色。画面景物繁复。上方左角大江浩淼，帆影依稀；右角山峰高峻，瀑流奔壑，山径左曲，至中幅复右折。近景绿树掩映，茅屋临溪。笔法苍秀醇厚，有雄奇磊落之致。
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