1) The sulfite pulse gild technics
亚硫酸脉冲镀金
2) Pulse gilding
脉冲镀金
3) ferrous sulphate coating
硫酸亚铁镀膜
4) Sodium gold sulfite
亚硫酸金钠
5) pulse plating
脉冲电镀
1.
General development situation of pulse plating in recent years;
近年来脉冲电镀发展概况
2.
Effect of addictive in copper interconnect in pulse plating;
添加剂对铜互连线脉冲电镀的影响
3.
Influence of Na_2WO_4 and NaH_2PO_2 concentrations on microstructures and properties of CeO_2-SiO_2/Ni-W-P nano-composite films prepared by pulse plating;
钨酸钠和次磷酸钠浓度对脉冲电镀CeO_2-SiO_2/Ni-W-P纳米复合薄膜组织及性能的影响
6) pulse electroplating
脉冲电镀
1.
Study on micro-hardness of Ni-Co alloy prepared by high-frequency pulse electroplating;
高频脉冲电镀镍钴合金的显微硬度研究
2.
Process of non-cyanide gold pulse electroplating and its application to cavum target;
无氰脉冲电镀金工艺及其在空腔靶中的应用
3.
Influential factors of Ni-SiC nano-composite coatings by high frequency pulse electroplating;
高频脉冲电镀Ni-SiC纳米复合镀层影响因素的研究
补充资料：硫酸二钠盐与甲醛、苯酚、亚硫酸氢钠和尿素的聚合物
CAS：81387-77-1
分子式：(C6H6O·CH4N2O·CH2O·H2O3S·H2O3S· 3Na)x
中文名称：硫酸二钠盐与甲醛、苯酚、亚硫酸氢钠和尿素的聚合物
英文名称：Sulfurous acid, disodium salt, polymer with formaldehyde, phenol, sodium hydrogen sulfite and urea
Sodium bisulfite, sodium sulfite, phenol, formaldehyde, urea polymer
分子式：(C6H6O·CH4N2O·CH2O·H2O3S·H2O3S· 3Na)x
中文名称：硫酸二钠盐与甲醛、苯酚、亚硫酸氢钠和尿素的聚合物
英文名称：Sulfurous acid, disodium salt, polymer with formaldehyde, phenol, sodium hydrogen sulfite and urea
Sodium bisulfite, sodium sulfite, phenol, formaldehyde, urea polymer
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条