It researches the hardware and software about‘open architecture control system of IC packaging platform with single CPU’.

This article describes the application of microelectronic plating in manufacture of semiconductor, IC packaging, micro-bumps, multichip modules and microelectronics mechanical systems.

The process of design for clamping unit of auto molding in IC packaging was introduced,and finite element model of clamping unit was established.

In this paper, new developmental trends for the miniaturization of IC packaging are introduced.

By adding pattern recognition system to IC package equipment, a manual wire-bonder to automatic one was successfully ameliorated.

As IC chips are fast developing toward higher density, higher performance and smallersize, to meet the demands of IC package, back thinning of the patterned wafer is one of most impor-tant procedure in the backend of semiconductor manufacturing process.

The development and requirements for the IC package and substrate technology were summarized.

Research of the High Dynamic Performance Moving Parts On Ultra-precision Stage

The paper base on the domestic research result and foreign research result on error compensation, aimed at the geometric feature of the 3D minuteness electric spark forming stage, by homogeneous transformation and the concept of "cut point", develop the three dimension kinematics synthesis er.

Shock response analysis of 6-DOF parallel motion platform;

Adaptive fuzzy backstepping control of light flight simulator motion platform;

Application of displacement sensor in 6 DOF motion platform;

Robust detection of moving objects from a moving platform:A sensor fusion approach;

To improve the capacity of aerial moving platform for target classification,a method of information fusion based on D-S theory was applied to the target identification of moving platform multi-sensor.