1) (1-Hydroxyethylidene)bis-phosphonic acid tetrasodium salt

羟基亚乙基二膦酸四钠
2) sodium ethylenediamine tetramethylene phosphonate

乙二胺四亚甲基膦酸钠
3) HEDP

羟基亚乙基二膦酸
1.
Improvement of Adhesion of Direct Copper Plating Layer from HEDP Bath;

提高羟基亚乙基二膦酸直接镀铜结合强度的研究
2.
Stability of inhibition ability of HEDP to CaCO_3 scale

羟基亚乙基二膦酸对抑制CaCO_3垢的稳定性研究
3.
The paper studied compatibility among three organic corrosion inhibitor(PBTCA、HEDP、ATMP)、 one inorganic corrosion inhibitor(ZnSO_4) and ClO_2.
从常用水处理药剂中选择3种有机膦药剂PBTCA(2-膦酸基丁烷-1,2,4-三羧酸)、HEDP(羟基亚乙基二膦酸)、ATMP(氨基三亚甲基膦酸)与C lO2、ZnSO4复配,通过正交试验确定了最佳配方,并利用从头计算法对该配方进行了量子化学计算,分析了缓蚀性能和分子结构的关系。
4) 1-hydroxyethylidene-1,1-diphosphonic

1-羟基亚乙基-1,1-二膦酸
1.
Up to now, only a few research groups work on the selection of passivation after acid cleaning by 1-hydroxyethylidene-1,1-diphosphonic, though passivation is the necessary procedure to protect the surface of the acid cleaned metals from rerusting.
1-羟基亚乙基-1,1-二膦酸酸洗后的预膜液的选择较少有人研究,而适当的预膜钝化是防止酸洗后金属表面返锈的必要措施。
5) Etidronic acid

(1-羟基亚乙基)二膦酸
6) (1-hydroxyethylidene)bis-phosphonic acid potassium salt

(1-羟基亚乙基)二膦酸钾
补充资料:羟基亚乙基二膦酸四钠
分子式:C2H4Na4O7P2
分子量:293.96
CAS号:3794-83-0
性质:
分子量:293.96
CAS号:3794-83-0
性质:
说明:补充资料仅用于学习参考,请勿用于其它任何用途。
参考词条