1) sealability
[,si:lə'biliti]
可热合性
2) thermoreversibility
热可逆性
1.
Study on thermoreversibility of phenol formaldehyde resin-borate hydrogels;
甲阶酚醛树脂-硼酸盐水凝胶的热可逆性研究
3) thermal reliability
热可靠性
1.
Simulation of thermal deformation is significant to enhance thermal reliability of electronic devices.
电子器件热变形的模拟对于提高器件的热可靠性有着重要意义 。
2.
Development of high heat flux chips requires better heat dissipation performance and higher thermal reliability of the electronics packaging, meanwhile, the miniaturization tendency and portability demand of the electronics packaging accelerate the research on the air-cooling technology.
高热流密度芯片发展要求封装器件具有更好的热耗散能力和更高的热可靠性;电子产品的小型化趋势及便携性要求则是空冷技术发展的助推剂。
4) thermal testability
热可测性
5) hot ductility
热[态可]塑性，热态可锻性
6) reversible thermochromism
可逆热色性
1.
They exhibited reversible thermochromism when heated and then cooled.
结果表明,双-N,N′-缩水杨醛联苯胺及其Ni(Ⅱ)配合物表现出了可逆热色性。
补充资料：连续性与非连续性(见间断性与不间断性)
连续性与非连续性(见间断性与不间断性)
continuity and discontinuity
11an父ux泊g四f“山。麻以角g、.连续性与非连续性(c。nt，n琳t:nuity一)_见间断性与不间断性。and diseo红ti-
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条