1) solder bump
撞击焊;焊接凸点
2) bonding pedestal
焊接凸点
3) projection weld
凸焊焊接
4) projection welding
凸焊;多点凸焊
5) spot welding
点焊接 、点焊
6) Solder bump
焊料凸点
1.
In this paper, a low cost flip chip interconnection is introduced, which electrolessNi as the under bump metallurgy (UBM), deposits solder paste using stencil printing, and reflowsthe paste to form solder bumps.
回顾了低成本制备芯片上焊料凸点的方法,即化学镀镍制备凸点下金属层、模版印刷焊料,最后回流形成焊料凸点,并综述了该方法的最新研究进展。
补充资料：凸凸
1.高出貌。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条