1) cabling equipment

成缆设备、布线设备
2) wiring shaping equipment

布线形成设备
1.
The world semiconductor equipment market in the year 1999~2000, consist of the equipment investment, the photolithography equipment and the wiring shaping equipment are introduced.
介绍了1999 ~2000 年世界半导体设备市场,包括设备投资、光刻机和布线形成设备。
3) implantation of device

设备布设
4) pay-off and take-up devices of wire and cable

线缆收放设备
5) wire and cable machinery

线缆制造设备
6) CVD Cable Termination Equipment

线缆终端设备
补充资料:净化设备——混凝设备
净化设备——混凝设备![]() ![]() ![]() ![]() | |
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说明:补充资料仅用于学习参考,请勿用于其它任何用途。
参考词条