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1)  copper column grid array
铜柱栅阵列
1.
6Cu and 63Sn37Pb were established based on creep law,and the stress-strain distribution of soldered joints in copper column grid array(CuCGA) devices was analyzed under the loadings of different temperature cycles.
6Cu和63Sn37Pb钎料的本构方程,分析铜柱栅阵列封装(CuCGA)器件在不同温度循环载荷下焊点的应力应变分布。
2)  ceramic column grid array
陶瓷柱栅阵列
3)  ceramic column grid array (CCGA)
陶瓷圆柱栅阵列
4)  column grid array (CGA)
圆柱栅格阵列
5)  BGA
球栅阵列
1.
Analysis on Stress and Strain Distribution of SnPb Solder Joint in BGA Package;
球栅阵列封装中SnPb焊点的应力应变分析
2.
Finite Element Analysis of Thermal Induced Damage in Ceramic BGA Devices Featuring Composite Solder Array;
复合球栅阵列CBGA封装器件热循环损伤的有限元模拟
3.
Thermal fatigue life of ceramic ball grid array(CBGA)devices under thermal cycling conditions was presented in-55℃～125℃.
研究了陶瓷球栅阵列(CBGA)器件在-55~125℃温度循环条件下的热疲劳寿命,采用光学显微镜研究了失效试件焊点的失效机制,分析了裂纹萌生和扩展的方式。
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6)  ball grid array
球栅阵列
1.
It can solve the problems such as inhomogeneous heating of different solder bumps in ball grid array,simultaneous heating of chip and carrier with solder ball,etc.
该方法能够很好地解决由于无铅钎料的应用引起的日益严重的诸多问题,如球栅阵列中各钎料球受热不均匀和芯片基板与钎料球同时受热等。
2.
The plastic ball grid array (PBGA) component test vehicles with different combinations of process parameters were designed based on full factorial experiment.
0mm引脚间距塑封球栅阵列(PBGA)器件测试样件,进行了500h的可靠性热循环试验;基于试验数据进行了极差分析和方差分析;用有限元方法分析了PBGA器件焊点内的应力分布。
3.
<Abstrcat>The orthogonal experiment design method was applied to study the relationships between solder joint process parameters and reliability of plastic ball grid array (PBGA) component.
　基于正交试验设计法对塑封球栅阵列(PBGA)器件焊点工艺参数与可靠性关系进行了研究。
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补充资料：铜柱
1.铜制的支撑建筑物的柱子。 2.神话传说中的天柱。 3.铜制的作为边界标志的界桩。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
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