1) Sn-Zn-Al lead-free solder
Sn-Zn-Al无铅钎料
1.
Investigation on fluxes for Sn-Zn-Al lead-free solder
Sn-Zn-Al无铅钎料的助焊剂研究
2) Sn-Zn lead-free solder
Sn-Zn无铅钎料
1.
Influence of Bi,Ag on microstructure and properties of Sn-Zn lead-free solder;
Bi、Ag对Sn-Zn无铅钎料性能与组织的影响
2.
However,the aplication of Sn-Zn lead-free solders was restricted in engineering because of oxidized easily and poor wettability.
但Sn-Zn无铅钎料易氧化,润湿性差,影响其在工程中的应用。
3) Sn-9Zn-Ag solder
Sn-Zn-Ag无铅钎料
6) Sn-Ag-Cu lead-free solder
Sn-Ag-Cu无铅钎料
1.
Wettability and spreadability of Sn-Ag-Cu lead-free solder on Cu substrate were tested by diode laser soldering system,influence of different soldering parameters on wettability and spreadability of Sn-Ag-Cu lead-free solder was studied.
采用半导体激光软钎焊系统对Sn-Ag-Cu无铅钎料在Cu基体上进行了润湿铺展性能实验,研究了半导体激光工艺参数对Sn-Ag-Cu无铅钎料润湿铺展性能的影响规律。
补充资料:[3-(aminosulfonyl)-4-chloro-N-(2.3-dihydro-2-methyl-1H-indol-1-yl)benzamide]
分子式:C16H16ClN3O3S
分子量:365.5
CAS号:26807-65-8
性质:暂无
制备方法:暂无
用途:用于轻、中度原发性高血压。
分子量:365.5
CAS号:26807-65-8
性质:暂无
制备方法:暂无
用途:用于轻、中度原发性高血压。
说明:补充资料仅用于学习参考,请勿用于其它任何用途。
参考词条