1.
Fabrication and Properties of SiCp/Al Electronic Packaging Housing by Gas Pressure Infiltration;
气压浸渗SiCp/Al电子封装外壳的制备与性能
2.
Investigation on Al/SiCp Electronic Packaging Materials Fabricated by Gas Pressure Infiltrating Processes;
气压浸渗法制备Al/SiCp电子封装材料的研究
3.
oil immersed forced air cooled transformer
油浸强制气冷变压器
4.
The FEM Simulation and Pressure Infiltration of Al_2O_3p/ZL104 Composites;
压力浸渗制备Al_2O_3p/ZL104复合材料及有限元模拟
5.
The FEM Simulation of the Liquid Infiltration-Extrusion Process Including Damage for Composites;
复合材料液态浸渗挤压有限元模拟及损伤研究
6.
The FEM Simulation of the Liquid Infiltration-Extrusion Process for Composites;
复合材料液态浸渗挤压过程的有限元模拟
7.
Research on the FEM Simulation of the Liquid Infiltration-Extrusion Process for Fabricating MMC;
液态浸渗挤压复合材料过程的有限元模拟
8.
The Structure and Properties of Al/SiCp Composites Preparated by Pressureless Infiltration for Electronic Packaging;
无压浸渗制备Al/SiCp电子封装材料的结构与性能
9.
Study of Flue Gas Desulfurization by Contained Liquid Membrane
液膜法烟气脱硫试验 Ⅰ.含浸液膜渗透器特性
10.
SO2 separation from flue gas in a hollow fiber contained liquid membrane permeator
中空纤维含浸液膜渗透器烟气脱硫的研究
11.
The interfacial reactions enhance the wettability and promote the spontaneous infiltration process.
界面反应的存在提高了润湿性,促进了无压自发浸渗。
12.
A Study on the Bending Strength and Wear Resistance of SiC/Al Composites by Pressureless Infiltration;
无压浸渗法制备SiC/Al复合材料强度和耐磨性的研究
13.
Preparation and Thermal Expansion Propertise of SiC_P/Al Composites by Vacuum Pressure Infiltration Precess;
真空压力浸渗法制备SiC_P/Al复合材料及热膨胀性能研究
14.
Pressureless Infiltration of SiCp/Al Electronic Packaging Materials with Particles of Bimodal Size Distribution;
无压浸渗制备双尺寸颗粒SiCp/Al电子封装材料的研究
15.
Study on Process and Thermal Properties of Si_P/Al Composites Prepared by Pressureless Infiltration;
高含量Si_P/Al热控制材料的无压浸渗工艺及热性能研究
16.
Effect of the Reactive Additions on the SiCp/Al Composites Fabricated by the Pressureless Infiltration Technique;
活性剂对无压自浸渗法制备SiCp/Al复合材料的影响
17.
Fabrication and Properties of β-SiCp/Al Electronic Packaging Material by Pressureless Infiltration;
无压浸渗法制备β-SiCp/Al电子封装材料工艺与性能研究
18.
Study on Technology and Properties of Al_2O_(3f)/AZ91D Composite Prepared by Pressrueless Infiltration Method;
无压浸渗法制备Al_2O_（3f）/AZ91D复合材料工艺及性能研究