1.
Synthesis and Electrochemical Properties of a Copper Plating Additive
电镀铜添加剂的合成及其电化学性能
2.
Study of Vertical-Structured GaN-Based LED by Electroplating Copper Layer;
GaN基垂直结构LED电镀铜衬底的研究
3.
Effect of pyrophosphate quality on copper electroplating
不同品质的焦磷酸盐对电镀铜的影响
4.
Copper Plating Process for Printed Circuit Board and Disposal of Common Problems
PCB电镀铜工艺和常见问题的处理
5.
Research on acidic copper additives used in through-hole plating of PCB manufacture
印制电路板中通孔电镀铜添加剂的研究
6.
To coat or finish with a layer of copper.
镀铜于给…包铜或镀铜
7.
The assembly shall have a electroless nickel-plated tubular copper body.
这种总成应该具有非电镀镀镍层管状铜阀体。
8.
Researches on Processes of Electroplating Zinc and Cu/Ni/Cr on AZ91D Magnesium Alloy;
AZ91D镁合金电镀锌及铜/镍/铬组合镀层工艺研究
9.
Electrochemical behavior of copper deposit on iron electrode in HEDP bath
铁电极上HEDP镀铜的电化学行为
10.
Study on Treatment of Electroplating Waste-water with Immobilized SRB
硫酸盐还原菌(SRB)固定化技术处理镀铜、镀铁混合电镀废水的研究
11.
RECOVERY OF Cu FROM ACIDIC COPPER RINSE WATER
槽边循环电解法从酸性镀铜废水中回收铜
12.
High Speed Acidic Electroplating Technology of Compact and Bright Sn and Sn-Cu Alloy for Copper Wire
铜线材酸性高速电镀致密光亮锡、锡铜合金
13.
Hot Tinning Process of Copper-constantan Thermocouples and Thermometric Characteristics Analysis
铜-康铜热电偶的热镀锡膜工艺和测温特性分析
14.
Metallic coatings-Electroplated coatings of copper for engineering purposes
GB/T12333-1990金属覆盖层工程用铜电镀层
15.
Study on the Technology of Bright Copper Plating in Acidic Copper Sulphate Solution With Additive Agent“153”
“153”酸性硫酸铜光亮电镀工艺的研究
16.
Automatic Potential Titration Analysis on Bright Acid Electroplating Copper Bath
自动电位滴定分析光亮酸性镀铜溶液
17.
Study on Plating 22K Au-Cu Alloy in Cyanide Free Bath;
无氰电镀22K金—铜合金工艺研究
18.
The study of electrochemical behaviors for a citrate alkaline copper plating bath
柠檬酸盐碱性镀铜的电化学行为研究