1.
Development and market distribution of 2L FCCL;
浅述二层挠性覆铜板的进展及市场分布
2.
The Synthesis of Phosphorous/Nitrogen-Containing Intumescent Flame Retardants and Their Application in FCCL
挠性覆铜板用磷-氮系膨胀型阻燃剂的合成研究
3.
Synthesis and Applied Research on Polyimide Used for 2-Layer Double-side Flexible Copper Clad Laminate
二层法双面挠性覆铜板用热塑性聚酰亚胺的合成与应用研究
4.
flexible copper-clad dielectric film
挠性覆铜箔绝缘薄膜
5.
Test methods for flexible copper-clad material for printed circuits
GB/T13557-1992印制电路用挠性覆铜箔材料试验方法
6.
Flexible copper-clad polyimide film for printed circuits
GB/T13555-1992印制电路用挠性覆铜箔聚酰亚胺薄膜
7.
Flexible copper-clad polyester film for printed circuits
GB/T13556-1992印制电路用挠性覆铜箔聚脂薄膜
8.
The Synthesis and Properties of Epoxy Resins Used in Copper Clad Laminates;
覆铜箔层压板专用环氧树脂的合成与性能
9.
Study on New Technique and Properties of Electroplating Ni-Fe Alloys on Copper Plate for Continuous Casting Mold
结晶器铜板镀覆Ni-Fe合金新工艺及性能研究
10.
New Generation High Heat Resistance,High Modulus and Low CTE Copper Clad Laminates
新一代高耐热性、高模量、低CTE覆铜箔层压板材料
11.
epoxide woven glass fabric copper-clad laminates
环氧玻璃布基覆铜箔板
12.
ployester woven glass fabric copper-clad laminates
聚酯玻璃布覆铜箔板
13.
UV Blocking copper-clad laminates
紫外线阻挡型覆铜箔板
14.
metal core copper-clad laminate
金属芯覆铜箔层压板
15.
Review of the Development of Copper Clad Laminate from JPCA SHOW
从JPCASHOW看覆铜板的发展
16.
Research on Flexible Materials and Adhesives for Rigid-Flex Boards
刚挠结合板用挠性材料和粘结材料性能研究
17.
Polyimide woven glass fabric copper-clad laminated sheet of defined flammability for printed circuits
GB/T16315-1996印制电路用限定燃烧性的覆铜箔聚酰亚胺玻璃布层压板
18.
PEEK Film used in White Copper Clad Laminate for LED Chips--Review of Development About Special CCL(4)
搭载LED的白色覆铜板用PEEK薄膜——特殊性能CCL的发展综述之四