1.
A Simulant Experiment Study of the Silicon s Mechanism in the CMP;
单晶硅片CMP磨损机理的模拟试验研究
2.
Material removal characteristic of silicon wafers in chemical mechanical polishing
单晶硅片化学机械抛光材料去除特性
3.
Study on the Surface Layer Damage of Monocrystalline Silicon Wafer Induced by Ultra-precision Grinding;
单晶硅片超精密磨削加工表面层损伤的研究
4.
Experimental Research on Ultra-precision Grinding Technology for Silicon Wafer Thinning
单晶硅片超精密磨削减薄技术试验研究
5.
Study on the Machining Performance of Single Crystal Silicon Wafer Cut by Using Reciprocating Electroplated Diamond Wire Saw
往复式电镀金刚石线锯切割单晶硅片特性研究
6.
Characteristic of Material Removal in Chemical Mechanical Polishing of Silicon Wafer Based on Abrasion Behavior
基于磨损行为的单晶硅片化学机械抛光材料的去除特性
7.
Monocrystalline silicon ascut slices and lapped slices
GB/T12965-1996硅单晶切割片和研磨片
8.
The Czochralski silicon monocrystalline polished wafer with a diameter of eight inches
8英寸直拉硅单晶抛光片
9.
Prediction and Measurement of Subsurface Damage Thickness of Silicon Wafer in Wire Saw Slicing
单晶硅线锯切片亚表层损伤层厚度预测与测量
10.
INFLUENCE OF FIRING PROCESS ON BOW OF THIN MONOCRYSTALLINE SILICON WAFERS FOR SOLAR CELLS
烧结工艺对薄片单晶硅太阳电池弯曲的影响
11.
The Research of Power Quality by Improve the Wafer Efficiency of the Monocrystalline Silicon Solar Cell
单晶硅太阳能电池硅片转换效率提高对并网电能质量的改善
12.
Research on the Laser Slotting on the Single Silicon Slice and Application;
激光在太阳能单晶硅圆片上划槽控制的研究与应用
13.
Monocrystalline germanium slices
GB/T15713-1995锗单晶片
14.
Now people can produce a wafer silicon.
现在人们能够生产一种硅晶薄片。
15.
International Standard - Grain-Oriented Electrical Steel Silicon Steel Sheet for Electrical Use
晶粒取向电器用硅钢片主要工业标准
16.
Crystallographic Features Study of Polycrystalline Silicon Ingot for Solar Cells
用于太阳能电池的多晶硅锭片晶体学特征研究
17.
Research of Nc-Si/c-Si Heterojunction MOSFETs Pressure-magnetic Mutli-sensor;
纳米硅/单晶硅异质结MOSFETs压/磁多功能传感器研究
18.
Selection of the Resistivity of Silion Monocvystalline of High-temperature Silion Power Devices;
高温硅功率器件所用硅单晶电阻率的选取