1.
Investigation on Fabrication of a Low Melting Point Lead-free Sn-Bi-X Solders and Lead-free Soldering Process;
低熔点无铅焊料Sn-Bi-X的研制与无铅焊接工艺研究
2.
Application and Development of Surface Mount Technology;
从有铅向无铅焊接过渡阶段应注意的问题
3.
A: IPC is currently working to revise the specification for inspection of lead-free solder joints.
IPC正在修订关于无铅焊接的质检标准。
4.
Quality problem and solution on lead-free solder was reviewed.
并对无铅焊接特有的质量问题及解决方法进行了评述。
5.
Design and Study on Properties in Sn-Based High Multicomponent Temperature Lead-Free Solders
Sn基多组元高温无铅焊接材料的设计及性能研究
6.
All-in-one complex tip design(70 W heater, sensor tip) has strong heat recovery for leadfree soldering.
一体化复合咀设计(0W发热芯,感温焊咀)强大回热功能,适用于无铅焊接.
7.
It covers the background, solders, surface finishes, components, substrates, assembly processes, rework, and reliability of lead-free soldering.
包括背景，焊料，表面镀层，元器件，基板，组装工艺，返工和无铅焊接的可靠性。
8.
Study of the Reliability of Power Device with Lead-free Heat-sink Attachment;
功率器件无铅焊料焊接层可靠性研究
9.
Thermomechanical Fatigue Properties of Lead-Free Solder Joints;
无铅合金钎焊接头热疲劳性能的研究
10.
Research of PBGA Voids in Lead-Free Reflow Process
无铅再流焊接PBGA空洞缺陷研究
11.
Research on the Properties and the Interfacial Reactions of Sn-Zn-Cu(Ni) Lead-free Solders;
Sn-Zn-Cu（Ni）无铅钎料及其钎焊接头界面反应研究
12.
Two Welding and Inspection Methods of Lead-free Pin Components
介绍两种无铅引脚元器件的焊接和检验方法
13.
Research of Lead-Free Wave-Soldering System Based on IPC
基于工控机的无铅波峰焊接机系统的研究
14.
Formation and Evolution of the Microstructures of the Sn-Ag-Zn Solders and the Interfaces with Cu Pad
Sn-Ag-Zn系无铅焊料及其连接界面组织形成与演化规律
15.
Microstructure and Performance of Sn-9Zn Based Lead Free Solder/Cu Solder Joint and Their Interface Region
Sn-9Zn基无铅钎料/Cu钎焊接头及界面区组织性能的研究
16.
Influence of Strain Rate Effect on Behavior of Solder Joints under Drop Impact Loading
应变率效应对无铅焊锡接点跌落冲击力学行为的影响
17.
Properties of Sn-3.0Ag-0.5Cu-xNi lead-free solders and soldering joints
Sn-3.0Ag-0.5Cu-xNi无铅焊料及焊点的性能
18.
Pb-free solders– Sn-Bi-Zn based with our own patent and their modification to fit for package applications.
无铅焊锡—锡铋锌系无铅焊锡，材料设计、发，焊料（球、膏）发等。