1.
A Study of New Flux for Sn-9Zn Lead-free Electronic Solders;
Sn-9Zn无铅电子钎料新型助焊剂研究
2.
Research on A Series of V-B Solder Used in Vacuum Electronic Devices
真空电子器件用V-B系列钎料研究
3.
Research development of high temperature lead-free solders for electronic assembly
电子组装用高温无铅钎料的研究进展
4.
Development of Lead Free Solder and Its Interfacial Issues in Electronics Packaging;
电子封装互连无铅钎料及其界面问题研究
5.
Study on the Lead-Free Solder Paste Prepared by Mechanical Alloying in SMT;
电子组装膏状钎料机械合金化制备及研究
6.
Research on PdNb Alloy Brazing Material Used for Cathode Welding of Vacuum Electron Devices
真空电子器件阴极焊接用PdNb合金钎焊料的研制
7.
Research Progress of Au-and Ag-based Mid-temperature Brazing Filler Alloys for Electronic Industry
电子工业用金基和银基中温钎料的研究进展
8.
FINITE ELEMENT IMPLEMENTATION TO TIME-DEPENDENT CONSTITUTIVE MODEL OF SOLDER IN MICRO-ELECTRONIC PACKAGING
微电子封装钎料时相关本构模型的有限元实现
9.
DETERMINATION OF Ag,Cu,Zn and Cd IN SILVER BRAZING FILLER METALS BY ICP AES
电感耦合等离子体发射光谱法测定银基钎料中银、铜、锌和镉的含量
10.
Time-Dependent Damage Coupled Constitutive Model of Solder Alloy in Micro-Electronic Packaging at High Tempertaure and It's Application;
微电子封装钎料高温时相关耦合损伤本构模型及其工程应用
11.
Damage-coupled Multiaxial Time-dependent Low Cycle Fatigue Failure for Electronic Packaging Solder Alloy
电子封装钎料合金耦合损伤的多轴时相关低周疲劳失效研究
12.
Regression analysis for Sn-Ag-Bi-Cu lead-free solder conductive properties
Sn-Ag-Bi-Cu无铅钎料导电性能回归分析
13.
Numerical Analysis of Fluid Flow and Velocity Field during Liquid Filler Droplet Spreading Behavior in Arc Brazing;
电弧钎焊钎料液滴铺展过程及其流场、速度场数值模拟和分析
14.
A Study of the Plating Process for Preparing Sn-Cu Lead-Free Solders by Electrodeposition
电沉积制备Sn-Cu无铅钎料电镀工艺的研究
15.
electric brazing
电加热钎焊;电热钎焊;电热铜焊;电热硬钎焊
16.
Study on the new type soldering acid and filler metal for restoration of ancient bronze;
古代青铜器修复钎焊用钎剂与钎料的改性研究
17.
The Technology of Resistance Brazing for Head Menging Sheathes of Inserting Copper Bar Rotors
插入式铜条转子并头套电阻硬钎焊工艺
18.
The Development of the Real-time Measurement System of the Temperature Field of the Electron Beam Jointing;
电子束钎焊温度场实时检测系统的研制