1.
Design and Simulation of Pre-bonding System of Flip Chip Equipment for RFID Packaging;
RFID倒装键合机预贴片系统设计与仿真
2.
Influence of Temperature on Alignment Accuracy in the Thermosonic Flip-chip Bonding
热超声倒装键合中温度对对准精度的影响
3.
Studies on Vibration Propagation and Performance Formation of Thermosonic Flip Chip Bonding Interface;
热超声倒装键合界面运动与界面性能的生成规律研究
4.
Analysis of the Inversion in the "Integrated shills of English" Course;
探讨《综合英语教程》中的倒装句型
5.
Layer-by-Layer Assembly of Polymers via Hydrogen Bonding or Halogen Bonding: Effect of Solvents;
基于卤键或氢键的聚合物层状组装：溶剂影响
6.
Investigation of the Glass-ceramics Used for Anodic Bonding Material in MEMS;
MEMS封装用静电键合微晶玻璃的研究
7.
The Key Equipment Research for Automobile Cluster and Monitor;
轿车显示器与组合仪表关键装备研究
8.
Comprehensive Comparison Between FC and CSP and Their Development Anticipation
倒装片封装与芯片规模封装的综合比较及其发展前景
9.
Shear Strength of Flip Chip Packaging Bonded with Anisotropic Conductive Film
倒装芯片各向异性导电胶互连的剪切结合强度
10.
glucosidic linkage
糖苷键[合],苷键[合]
11.
Ultrasonic Bonding System Applied to the Package of Polymer Micro Parts;
应用于聚合物微器件封装的超声波键合系统
12.
Synthesis and Characterization of Intermolecular Hydrogen Bond Induced Supermolecular Liquid Crystalline Compound
氢键自组装超分子液晶复合物的合成及表征
13.
Studies on a Side Chain Liquid Crystalline Polymer Self-Assembling Through Intermolecular Hydrogen Bond
一种通过分子间氢键自组装的侧链液晶聚合物
14.
Research on Design Method and Properties of Eletronic Packaging Single Crystal Copper Wire;
电子封装单晶铜键合丝制备工艺及性能研究
15.
Study on the Application of Bonding Technology for Cu/Sn Isothermal Solidification in MEMS Hermetic Package;
Cu/Sn等温凝固键合在MEMS气密封装中的应用研究
16.
Study on a New Al-1%Si Bonding Wire for Encapsulation of Integrate Circuit;
集成电路封装用新型Al-1%Si键合线的研制
17.
Mechanism and Process of Cu-Sn Bonding for Wafer Level MEMS Packaging
MEMS圆片级封装用Cu-Sn低温键合机理与工艺研究
18.
Study on Low Temperature Glass Frit Bonding for MEMS Device
MEMS器件封装的低温玻璃浆料键合工艺研究