1.
Research of Electrodeposition Gallium Arsenide Thin Film Material;

电共沉积法制备GaAs薄膜材料研究
2.
Investigation on Microstructure and Performance of AgFe_2O_3 Electrical Contact Material Fabricated by Co-precipitation Technology
共沉积法AgFe_2O_3电接触材料的组织与性能研究
3.
Nanodiamond/Copper Composites Fabricated by Chemical Co-Deposition Metallurgy;

化学共沉积法制备纳米金刚石/铜基复合材料的研究
4.
PREPARATION OF COPRECIPITATE OF BDD ETC.BY SOLVENT DEPOSITE METHOD AND ITS BEHAVIOR

溶剂沉积法制备联苯双酯共沉淀物及其性能考察
5.
A Study on Preparing Bioactive Graded Ceramic Coating on Titanium Alloy by Electrophoresis Codeposition and Sintering Method;
电泳共沉积—烧结法制备钛合金表面生物活性梯度陶瓷涂层的研究
6.
Structural Evolution and Properties of Amorphous Silicon-Carbon Thin Films Deposited by Micro-wave Electron Cyclotron Resonance Plasma;
微波电子回旋共振法沉积的非晶碳化硅薄膜结构和性能研究
7.
Preparation of Amorphous Silicon Nitride Film by ECRCVD;

用电子回旋共振化学气相沉积(ECRCVD)方法制备非晶态氮化硅薄膜
8.
HT-CVD(high temperature chemical vapour deposition)

高温化学蒸汽沉积法
9.
MECHANISM AND KINETICS OF ELECTROPHORETIC DEPOSITION (EPD) OF YTTRIA-STABILIZED ZIRCONIA (YSZ) FILM
电泳沉积法制备固体电解质薄膜的沉积速率和沉积机理
10.
The Current Status and Evolution of Abnormal Co-deposition Mechanisms in Zn-based Alloy;

锌基合金异常共沉积的机理研究现状
11.
Process for Electroplating of Pb-Sn-Cu Ternary Alloy Coating

Pb-Sn-Cu合金共沉积工艺研究
12.
The Effect of Conjugated Linoleic Acid (CLA) on Lipid Deposition in HepG2 Cells

共轭亚油酸对HepG2细胞脂质沉积的影响
13.
Preparation of Ultrafine Fe_3O_4 by Chemical Co-precipitation

共沉淀法制备超细微Fe_3O_4
14.
Pt-Pb Coelectrodeposition/Stripping Protocol to Prepare Nano-Pt Modified Glassy Carbon Electrodes for Electrocatalytic Oxidation of C1 Organic Small Molecules
铂-铅电化学共沉积/溶铅法制备纳米铂修饰玻璃碳电极及其对C1小分子的电催化氧化
15.
Study on Preparation of Mn-Zn Ferrite Powder by Direct Coprecipitation

直接共沉淀法制备锰锌软磁铁氧体共沉粉
16.
Electrochemical synthesis and photovoltaic properties of polythiothene/CdSe electrode

聚噻吩/硒化镉共敏化电极的电沉积与光伏性能
17.
Micro-Arc Oxidation-Electrochemical Co-precipitation of Calcium Phosphate Coatings on Titanium Alloys
微弧氧化-电化学共沉积磷酸钙类涂层的研究
18.
The dry plating method is a method for deposition of a metal on the surface of polymer material under vacuum and includes sputtering method, vapor deposition, vacuum deposition, etc.
干镀是一种在真空下在聚合物表面沉积金属的方法,包括溅射、气相沉积、真空沉积等。