1.
CROSS SECTION CHANGING GROWTH PHENOMENON OF Sn WHISKER IN Sn-3.8Ag-0.7Cu-1.0Er LEAD-FREE SOLDER
Sn-3.8Ag-0.7Cu-1.0Er无铅钎料中Sn晶须变截面生长现象
2.
Formation of Sn whiskers from ball milled powder at room temperature
室温下球磨粉体中Sn晶须的自发生长
3.
FORMATION OF WHISKER AND HILLOCK IN Cu/Sn-58Bi/Cu SOLDERED JOINT DURING ELECTROMIGRATION
Cu/Sn-58Bi/Cu焊点在电迁移过程中晶须和小丘的生长
4.
A Study on Hypoeutectic Sn-Zn Alloys as Lead-free Solders;
亚共晶Sn-Zn合金无铅电子焊料研究
5.
Study on the Non-eutectic Sn-Bi Solders with Low Melting Point;
Sn-Bi系低熔点非共晶无铅焊料的研究
6.
Research on the Directionally Solidified Microstructure of Cu-Sn Peritectic Alloys;
Cu-Sn包晶合金定向凝固组织研究
7.
Tin Segregation Behavior to Grain-Boundary and the Hot Ductility of Low Carbon Steel;
Sn的晶界偏聚行为与低碳钢的热塑性
8.
Crystal Growth Kinetics of Cerium-based Sn-containing Oxides
Ce基含Sn氧化物晶粒长大动力学
9.
Properties of Sn-0.65CuX modified hypoeutectic solder in nelting state
Sn-0.65CuX亚共晶改性钎料的液态性能
10.
Influence of Magnetic Field on Lamellar Eutectic of Pb-Sn Alloy
磁场对Pb-Sn合金层状共晶生长的影响
11.
Corrosion Resistance of Ternary Ni-Ta-Sn Amorphous Alloy
Ni-Ta-Sn非晶合金的耐腐蚀性能
12.
Rapid Growth of Pb-Sb-Sn and Pb-Sn-Zn Ternary Eutectics under Substantial Undercooling Conditions;
深过冷条件下Pb-Sb-Sn和Pb-Sn-Zn三元共晶的生长规律研究
13.
Tin Whisker Growth of Sn and SnPb Thin Films
Sn及SnPb薄膜表面锡须生长研究
14.
Microstructure and Properties of Rapidly Solidified Cu-Sn Hypoperitectic Alloys;
快速凝固Cu-Sn亚包晶合金的微观结构与性能
15.
Grain Boundary Character Distributions of Rolled and Annealed Pb-Ca-Sn-Al Alloy;
Pb-Ca-Sn-Al合金轧制退火晶界特征分布研究
16.
Effect of Grain Boundary Segregation of Residual Elements Cu-As-Sn on Intergranular Embrittlement Fracture of Low Alloying Steel
低合金钢残余元素Cu-As-Sn的晶界偏析对晶间脆性断裂的影响
17.
Separation of Intermetallic Compounds in the Microstructure of Eutectic Sn-Ag-Zn Solder Solidified at Different Cooling Rates;
宽冷却速度下共晶Sn-Ag-Zn焊料组织中金属间化合物的析出
18.
Influence of Tramp Elements Arsenic, Tin and Antimony Segregation to Grain Boundary on Hot Ductility of CC Steels;
残留元素As、Sn、Sb的晶界偏聚对连铸钢热塑性的影响