1.
Reflow Process Simulation for BGA Package by FEA;
球栅阵列封装中回流焊工艺的有限元模拟
2.
Study on Stress-Strain and Thermal Failure of Ball Grid Array Package
球栅阵列封装的应力应变及热失效研究
3.
Integrated life prediction method of ball grid array soldered joint
球栅阵列封装焊点寿命预测的综合方法
4.
Robotics Ball Attachment Workcell for Ball Grid Array Semiconductor Packages;
用于集成电路球栅阵列（BGA）封装的全自动植球机的研制开发
5.
Finite-Element Simulation and Solder Joint Life Predictions for Chip Scale Ball Grid Array Size Package;
球栅阵列尺寸封装的有限元法模拟及焊点的寿命预测分析
6.
FC-BGA Flip-Chip Ball Grid Array
反转芯片球形栅格阵列
7.
Solder Ball Attachment Assessment of Reballed Plastic Ball Grid Array Packages
再成形(Re-Balled)焊球阵列封装的焊球强度评估
8.
Area Array Package--BGA/CSP & flip chip
BGA/CSP和倒装焊芯片面积阵列封装技术
9.
Multi-chip Array Combination White Light LED Seal Research
多芯片阵列组合白光LED封装研究
10.
Failure Analysis of BGA Lead-free Solder Joints under Drop Impact
跌落碰撞下球栅阵列无铅焊点失效分析
11.
FC-PGA Flip-Chip Pin Grid Array
反转芯片针脚栅格阵列
12.
OPGA Organic Pin Grid Array
有机塑料针型栅格阵列
13.
Research on Machine Vision Alignment Technology of Area Array Packaging;
面阵列芯片封装设备中的视觉定位技术
14.
Mechanical property of UV curable adhesive bonding in packaging of fiber array waveguide device
阵列波导器件封装用UV胶粘接力学性能分析
15.
Elastic-Plastic-Creep Computational Analysis & Reliability Evaluation of Ball Grid Array Solder Joint in Cemaric Quartz Chip (CBGA);
陶瓷芯片球栅阵列（CBGA）焊点弹塑性—蠕变计算分析及可靠度评估
16.
Encapsulation study on fiber Bragg grating for intelligent clothing
智能服装用光纤Bragg光栅的封装研究
17.
Light Source Analysis and Design of Machine-vision for Array Waveguide Bonding
阵列波导器件封装中机器视觉系统的光源分析与设计
18.
Analysis and Design of Quasi-optical Grid Arrays Using EMF Method
准光学栅格振荡器阵列的分析与设计