1.
					
							8 Inch Copper Chemical Mechanical Polish Process vs Wafer Corrosion Defect Reduction Method;
						
						
						八英寸铜化学机械研磨工艺对硅片腐蚀的改善
					2.
					
							STUDY OF MECHANICAL FORCE CHEMISTRY FOR CaCO_3/SiO_2 GRINDING
						
					
					
						
						
					
					
						CaCO_3/SiO_2粉磨机械力化学研究
					3.
					
							Mechano-chemical effects of α-Fe_2O_3 powder in super-fine ground by ball-stirring mill in wet
						
						
						湿法超细研磨中α-氧化铁机械力化学效应研究
					4.
					
							Study on Mechanical-Chemistry and Physical Properties of Mechanically Ground Fly Ash;
						
					
					
						
						
					
					
						粉煤灰机械研磨中物理与机械力化学现象的研究
					5.
					
							Used in grinding of chemical pulp,semichemical mechanical pulp,high-yield pulp(cold impregnation) and fiber board materials.
						
						
						用于化学浆、半化学机械浆、冷浸法高得率浆及纤维板料的研磨。
					6.
					
							Woodfree pulp: Pulp which is processed chemically and which contains no mechanical groundwood.
						
						
						不含磨木浆:用化学方法制造,不含机械磨木的浆。
					7.
					
							Analysis of Eucalyptus CTMP by XPS and SEM
						
					
					
						
						
					
					
						桉木化学热磨机械浆的XPS和SEM分析
					8.
					
							Experimental Study on Wastewater Turbidity in Semiconductor Mechanical Attrition by Chemical Coagulation
						
						
						化学混凝去除半导体机械研磨废水浊度的实验研究
					9.
					
							Study on Mechanochemistry Effect of Mineral Phases Grinding of Cementbased Material and Fractal Theory;
						
						
						水泥基材料矿相粉磨机械力化学效应与分形理论研究
					10.
					
							Study on the Technologic Parameter and Wear Model of Retaining Ring in Chemical Mechanical Polishing Process;
						
						
						化学机械抛光保持环工艺参数及磨损模型的研究
					11.
					
							Micro/Nanometer MoC Powders Prepared by High-Energy Mechanochemistry Method and Coating Abrasion Test
						
						
						高能机械化学法制备微纳米MoC粉体及涂层磨损试验研究
					12.
					
							Preparation and Size Classification of Alumina Series Abrasive Particles for Chemical Mechanical Polishing;
						
						
						氧化铝系化学机械抛光磨料的制备及颗粒分级
					13.
					
							Preparation of Ti or Zr-doped Ceria Abrasives and Their Chemical Mechanical Polishing Performance
						
						
						钛锆掺杂CeO_2磨料的制备及其化学机械抛光性能
					14.
					
							Chemical mechanical polishing for silicon wafer by composite abrasive slurry
						
					
					
						
						
					
					
						利用复合磨粒抛光液的硅片化学机械抛光
					15.
					
							Synthesis of AlH_3 by a Ball-Milling Solid-Phase Chemical Reaction and Its Hydrogen Desorption Properties
						
						
						机械球磨固相化学反应制备AlH_3及其放氢性能
					16.
					
							Research on Thermodynamics and Kinetics of Mechanical Milling-HDDR Process for NdFeB Alloy
						
						
						NdFeB合金机械球磨-HDDR过程的热力学与动力学研究
					17.
					
							Microstructure and Properties of Surface Nanocrystallized CP-Ti Processed by SMAT;
						
					
					
						
						
					
					
						机械研磨工业纯钛表面纳米化与组织性能研究
					18.
					
							Mechanism of Surface Nanocrystallization of Titanium during Surface Mechanical Attrition
						
					
					
						
						
					
					
						表面机械研磨工业纯钛表面纳米化研究