1.
Corrosion Research of Different Lead Free Wave Solder Pot Materials;
无铅波峰焊不同锡炉材料溶蚀行为研究
2.
Effect of Trace Phosphorus on the Oxidation Resistance of Lead-Free Solder Used in Wave Soldering;
微量磷对无铅波峰焊钎料抗氧化性影响的研究
3.
Research of Lead-Free Wave-Soldering System Based on IPC
基于工控机的无铅波峰焊接机系统的研究
4.
Production Characteristic of the Solder Dross during Lead-Free Wave Soldering and Process Solution of Reducing It;
无铅波峰焊钎料氧化渣形成特点及其改善的工艺措施
5.
WS Wave Soldering
波峰焊接，THT元件的焊接方式
6.
activated rosin flux for wave soldering
松香型波峰焊用活性助焊剂
7.
Establishment and Analysis of Wave Soldering Solder Joints Finite Element Model
波峰焊焊点有限元模型的建立与分析
8.
Study of the Reliability of Power Device with Lead-free Heat-sink Attachment;
功率器件无铅焊料焊接层可靠性研究
9.
Properties of Sn-3.0Ag-0.5Cu-xNi lead-free solders and soldering joints
Sn-3.0Ag-0.5Cu-xNi无铅焊料及焊点的性能
10.
Pb-free solders– Sn-Bi-Zn based with our own patent and their modification to fit for package applications.
无铅焊锡—锡铋锌系无铅焊锡，材料设计、发，焊料（球、膏）发等。
11.
Pb-free solders ? Sn-Bi-Zn based with our own patent and their modification to fit for package applications.
无铅焊锡—锡铋锌系无铅焊锡，材料设计、开发，焊料（锡球、锡膏）开发等。
12.
Maintenance the Wave soldering(WS) machine to ensure the maximum capability and efficiency. Trouble shooting.
即时修护波峰焊机器产生之问题，维持波峰焊最佳之产能与效率。
13.
Clear how to measuring reflow and wave profile.
清楚怎样测量回流焊和波峰焊温度曲线。
14.
Familiar Wave soldering process. Familiar with assembly and packing process.
熟悉波峰焊制程，熟悉组装和包装制程。
15.
The Research of Sn-Zn System without Ag Lead-free Solder
新型Sn-Cu系无银无铅焊料的研究
16.
Investigation on Fabrication of a Low Melting Point Lead-free Sn-Bi-X Solders and Lead-free Soldering Process;
低熔点无铅焊料Sn-Bi-X的研制与无铅焊接工艺研究
17.
Application and Development of Surface Mount Technology;
从有铅向无铅焊接过渡阶段应注意的问题
18.
Effect of Cooling Rate on Quality of Solder Joints in Lead-Free Reflow Soldering;
无铅回流焊冷却速率对焊点质量的影响