1.
Study of the Process of the Flip Chip Package Based on Aluminum Nitride Substrate
以氮化铝陶瓷为基板的倒装式封装工艺研究
2.
Design of a Vacuum Adsorption Dumping Gear for Flip Chip
真空吸附式倒装芯片翻转机械手设计
3.
Chain Upside -down Mounting of Big Steel Vertical Storage Tanks
大型钢制立式储罐的导链式倒装法施工
4.
Research on MEMS Capacitive Pressure Sensors Based on Flip-Chip Technology;
基于倒装技术的MEMS电容式压力传感器研究
5.
Must a Sentence Be Inverted When Its Negative Adverbial Is Put at Its Beginning;
句首否定式状语一定会造成句子倒装吗
6.
Reliability Analysis of the Internal Steel Stacks Installation in Multi-flue Chimney Based on the Hydraulic Lifting Upside-down Method;
基于液压提升倒装法的多管式烟囱钢内筒安装可靠性分析
7.
Discussion on Construction Method of Vertical Metal Storage Tank--Upside-down Method by Chain-type Electric Hoists on Each Masts Around
浅述立式金属储罐施工技术——群桅链式电动葫芦起吊倒装法
8.
upside-down mounting
倒装法 -集成电路组装的
9.
We'll have to finish the jog, however long it takes.
注意：这里是表语倒装和宾语倒装，主要动词没有倒装。
10.
The challenger took a dive.
挑战者假装被击倒.
11.
Electromigration in Sn3.0Ag0.5Cu flip chip solder joint
Sn3.0Ag0.5Cu倒装焊点中的电迁移
12.
Not that we want to make believe that we are madmen; we will go mad, though, in our own time and in our own way.
倒不是我们想要伪装疯狂，尽管在我们的时代，以我们的方式，我们迟早会疯狂。
13.
An Overview of Non destructive Inspection in Flip Chip Packaging
倒装焊芯片封装中的非接触检测技术
14.
Flip Chip will be a New Method of Packaging Technology
倒装芯片将成为封装技术的最新手段
15.
Bumping Technology for MEMS Flip Chip Packaging;
MEMS封装中的倒装芯片凸点技术
16.
Area Array Package--BGA/CSP & flip chip
BGA/CSP和倒装焊芯片面积阵列封装技术
17.
a knockout feigned by prearrangement between prizefighters
"职业拳击手事先安排的假装被击倒,佯倒."
18.
The technique of reversing, or inverting the normal word order of a sentence.
倒装句：一种将句子正常的表达方法倒置的技巧。