1.
Numerical Simulation Study and Application of Interface Delamination in High Density Electirc Packaging;
高密度芯片封装中界面分层的数值模拟研究及其应用
2.
super chip
高密度芯片,超级芯片
3.
Shorts between metal runners are important only in those regions of the chip with a high density of closely packed metal runners.
金属布线间的短接，仅在那些具有高密度密集封装型金属布线的芯片中才极为重要。
4.
Motion Control System Design of a High Speed Precision Positioning Platform for IC Package;
面向芯片封装的高速精密定位平台控制系统设计
5.
Study on High-Acceleration/High-Precision Aerostatic Positioning Stage for IC Packing;
面向芯片封装的高加速度高精度气浮定位平台的研究
6.
Experimental Investigation on the Performance of Devices for Heat Dispersing of Chips and Enclosure;
芯片及密封机柜散热装置的性能实验研究
7.
Research on Friction Analysis and Compensation for the High-Speed & High-Accuracy IC Packaging Platform;
高速高精芯片封装平台的摩擦分析及补偿研究
8.
The letter was contained in a bottle fast as a Kentish oyster.
那封信装在一只高度密封的瓶子里。
9.
The rapid increase in the integrated degree and dimension of chips, the more I/ O pins number, fine line pitch and miniaturization in package would result in the degradation of reliability of electronic devices.
芯片集成度的提高和大面积化，封装多针脚、引线、型化等会引起器件可靠性的下降。
10.
An Overview of Non destructive Inspection in Flip Chip Packaging
倒装焊芯片封装中的非接触检测技术
11.
Flip Chip will be a New Method of Packaging Technology
倒装芯片将成为封装技术的最新手段
12.
Bumping Technology for MEMS Flip Chip Packaging;
MEMS封装中的倒装芯片凸点技术
13.
Area Array Package--BGA/CSP & flip chip
BGA/CSP和倒装焊芯片面积阵列封装技术
14.
Investigation of Improving HD-PCB Substrate Packaging Quality
改善PCB高密度基板封装质量的研究
15.
High-density IC Packaging Based on Flexible Printed Circuit
基于挠性基板的高密度IC封装技术
16.
Research of Surface Treatment of In-Situ Synthesis High Density Gene Chips;
原位合成高密度基因芯片表面处理研究
17.
3D Stacking Packaging in SMT for High Density Packaging
满足高密度组装的SMT三维封装堆叠技术
18.
Research on welding fault during LED chips packaging
LED芯片封装工艺中焊接缺陷研究