1.
The Study of the Effect of Sb on Sn-0.7Cu Lead-free Solder;
Sb对Sn-0.7Cu无铅钎料性能影响的研究
2.
Investigation of Indentation Creep Behavior of Sn-0.7Cu Lead-free Solder
Sn-0.7Cu无铅钎料的压入蠕变行为研究
3.
The Influences of Minor Elements on Sn-0.7Cu Lead-free Solder
微量添加元素对Sn-0.7Cu无铅钎料性能的影响
4.
Effect of the Indentation Creep Property of Sn-0.7Cu Lead-free Solder Containing Alloy Elements
合金元素对Sn-0.7Cu无铅钎料压入蠕变性能的影响
5.
The Development and Study of Low Ag Sn-0.3Ag-0.7Cu-XBi Lead-free Solder;
Sn-0.3Ag-0.7Cu-XBi低银无铅钎料的开发与研究
6.
Wettability test of Sn-0.7Cu-xAg-yBi lead-free solder
Sn-0.7Cu-xAg-yBi无铅钎料润湿性试验
7.
Effect of Ge on Oxidation Resistance of Sn-0.3Ag-0.7Cu Lead-free Solder
Ge对Sn-0.3Ag-0.7Cu基无铅钎料抗氧化性影响
8.
CROSS SECTION CHANGING GROWTH PHENOMENON OF Sn WHISKER IN Sn-3.8Ag-0.7Cu-1.0Er LEAD-FREE SOLDER
Sn-3.8Ag-0.7Cu-1.0Er无铅钎料中Sn晶须变截面生长现象
9.
Research progress of Sn-0.7Cu system lead-free solder modified by microelements
微量元素改性Sn-0.7Cu系无铅钎料的研究进展
10.
The Study of the Effect of Ni on Sn-0.3Ag-0.7Cu Lead-Free Solder and the Nano-Mechanical Properties of Solder;
Ni对Sn-0.3Ag-0.7Cu无铅钎料性能影响及其纳米级力学行为的研究
11.
Effect of Bi on Microstructure and Propertities of Sn-0.3Ag-0.7Cu Solder
Bi对低银无铅钎料Sn-0.3Ag-0.7Cu接头组织和性能的影响
12.
The Study of Sn-Ag and Sn-Zn Multi-Composition System Lead-Free Solder Alloys;
Sn-Ag和Sn-Zn系多组元无铅软钎料研究
13.
Research on Indentation Creep Property of Sn-3.5Ag-2Bi-0.7Cu Lead-Free Solder
Sn-3.5Ag-2Bi-0.7Cu无铅焊料压入蠕变性能的研究
14.
The Study on Mixture Design of Multiplex Sn-Zn System Lead-free Solder;
多元Sn-Zn系无铅钎料混料设计的研究
15.
Research on Compressive Creep Bechavior of the Sn-Cu Lead-free Solder;
Sn-Cu无铅钎料压蠕变性能的研究
16.
Study on Compressive Creep Properties of the Sn-Zn Lead-free Solder;
Sn-Zn无铅钎料压蠕变行为的研究
17.
Development of New Flux Used for Sn-9Zn Lead Free Solder;
Sn-9Zn无铅钎料助焊剂的研究
18.
A Study of New Flux for Sn-9Zn Lead-free Electronic Solders;
Sn-9Zn无铅电子钎料新型助焊剂研究