1.
Curing Behavior and Property of Modified O-cresol Formaldehyde Epoxy Resin for High Density Interconnect/Build-up Multilayers;
高密度多层线路板用改性邻甲酚醛环氧树脂的固化行为及性能
2.
multilayer and high density fine-pitch printed circuit board
多层和高密度细线距的印刷电路板；多层和高密度细线距的线路板
3.
high density fine pitch printed circuit board
高密度细线距印刷电路板；高密度细线距线路板
4.
Uniformity of fluidized solids heights in multistage sieve tray fluidized bed
多层筛板流化床料层高度均匀性研究
5.
Application of high density resistivity method to determination of aquifer thickness in top rock
应用高密度电阻率法探测顶板基岩含水层厚度
6.
High Precision Linear Cutting of Extra Long Aluminum Honeycomb Sandwich Plates
超长铝蜂窝夹层板的高精度直线切割
7.
Application of the high density electrical prospecting to rich water survey of downhole coal plate.
高密度电法探测井下煤层顶板富水性效果
8.
The machine frame is made of high-quality wood and panel with good sealing high static electricity resistance and low noise.
机体结构采用优质木材和多层木板，密封程度高，抗静电性能好，工作噪音小。
9.
THE RELATION BETWEEN OXYGEN GREEN LINE INTENSITY AND OXYGEN ATOM DENSITY IN THE UPPER ATMOSPHERE
高层大气中氧绿线强度与氧原子密度的关系
10.
Technology designing for high-density fiberboard continuous press line
高密度纤维板连续平压生产线工艺设计
11.
The distance between the water line and the uppermost full deck of a ship.
出水高度船的吃水线与最高层甲板之间的距离
12.
compensated formation densilog curve
补偿地层密度测井曲线
13.
Electrothermal Analysis of Multilevel High-Density Interconnects in the Presence of ESD Pulses Using the Time-Domain Nonlinear Finite Element Method
多层高密度互连在静电脉冲作用下的时域非线性有限元电热耦合模拟
14.
Electroless Plating Technology of High Precision Ceramic Substrate
高精度陶瓷基板化学镀多层膜技术研究
15.
Reasonable matching of wafer and wire: the advanced matching of wafer improves average voltage in electric field and current density of wafer corona, which the dedusting efficiency is higher.
板线匹配更合理。先进的板匹配，有效地提高了电场平均电压和板电晕电流密度，收尘效率更高。
16.
The research on surface stability of the forming of high precision for large and high precision reflecting panel
大型夹层结构高精度反射器面板精密成形及型面稳定性
17.
Control Effect of Occupational Hazards in Production Project of Multilayer Printed Circuit Board
某多层线路板生产项目职业病危害控制效果评价
18.
Palladium as Diffusion Bar--A Way to a Multifunctional Printed Circuit Board Finish
以钯作扩散阻挡层——一种多功能线路板表面处理方法