1.
Research on the Theory & Experiments of SMT Lead-Free Solder Joint Reliability under Drop Impact;
跌落碰撞下SMT无铅焊点可靠性理论与实验研究
2.
An AOI algorithm for transistor lead-free solder joints of SMT post-reflow
SMT炉后晶体管类元件无铅焊点的自动光学检测算法
3.
The Improvement of the Solder Paste Performance and the Effect of Composition on It;
SMT无铅焊锡膏性能的改进及其组份对性能的影响
4.
Properties of Sn-3.0Ag-0.5Cu-xNi lead-free solders and soldering joints
Sn-3.0Ag-0.5Cu-xNi无铅焊料及焊点的性能
5.
Research on Reliability of SMT Soldered Joints and FEM Analysis of CBGA Soldered Joints;
SMT焊点的可靠性研究及CBGA焊点有限元分析
6.
Research on Reliability of SMT Solder Joint in Dynamic Tensile Load
动态拉伸载荷下SMT焊点可靠性研究
7.
Investigation on Fabrication of a Low Melting Point Lead-free Sn-Bi-X Solders and Lead-free Soldering Process;
低熔点无铅焊料Sn-Bi-X的研制与无铅焊接工艺研究
8.
Study on the Non-eutectic Sn-Bi Solders with Low Melting Point;
Sn-Bi系低熔点非共晶无铅焊料的研究
9.
Finite element analysis on reliability of lead-free soldered joints for CSP device
CSP器件无铅焊点可靠性的有限元分析
10.
Thermal reliability optimization study on PBGA lead-free solder joint
PBGA无铅焊点热可靠性优化研究
11.
Effect of Cooling Rate on Quality of Solder Joints in Lead-Free Reflow Soldering;
无铅回流焊冷却速率对焊点质量的影响
12.
SnAgCuBi-Solder Alloy Development and Its Joint Interfacial Behavior Study;
SnAgCuBi系无铅焊料的开发及其焊点界面行为的研究
13.
Failure analysis of lead-free solder joints based on resistance strain critical point
基于电阻应变临界点的无铅焊点失效分析
14.
The Lead Free Technology Research and Inspection for Electronical Product Base on Surface Mount Technology;
基于SMT电子产品的无铅化技术研究及检测
15.
Inspection Solder Quality Research of SMT Based on Machine Vision;
基于机器视觉的SMT焊点质量检测的研究
16.
Study on Automatic Optical Inspection System for SMT Solder Joints Based on Machine Vision
基于机器视觉的SMT焊点自动光学检测系统研究
17.
SMT Solder Joint 3D Reconstruction Technology Based on Shape from Shading
基于SFS原理的SMT焊点表面三维重构技术研究
18.
Study on ANN-based Expert-System Applied to SMT Solder Joint Quality Control
基于神经网络的SMT焊点质量控制专家系统设计