1.
Area Array Package--BGA/CSP & flip chip
BGA/CSP和倒装焊芯片面积阵列封装技术
2.
Research on Machine Vision Alignment Technology of Area Array Packaging;
面阵列芯片封装设备中的视觉定位技术
3.
Multi-chip Array Combination White Light LED Seal Research
多芯片阵列组合白光LED封装研究
4.
Reflow Process Simulation for BGA Package by FEA;
球栅阵列封装中回流焊工艺的有限元模拟
5.
Study on Stress-Strain and Thermal Failure of Ball Grid Array Package
球栅阵列封装的应力应变及热失效研究
6.
Integrated life prediction method of ball grid array soldered joint
球栅阵列封装焊点寿命预测的综合方法
7.
Mechanical property of UV curable adhesive bonding in packaging of fiber array waveguide device
阵列波导器件封装用UV胶粘接力学性能分析
8.
Solder Ball Attachment Assessment of Reballed Plastic Ball Grid Array Packages
再成形(Re-Balled)焊球阵列封装的焊球强度评估
9.
Research on Large Area Semiconductor Laser Array Shaping
大面积半导体激光器阵列光束整形研究
10.
Synthesis of large-area, vertically aligned α-Fe_2O_3 nanowire and nanobelt arrays
大面积α-Fe_2O_3纳米线及纳米带阵列的制备研究
11.
In-Beam Test of Large Area Scintillating Fiber Array Detector
大面积闪烁光纤阵列探测器的在束测试
12.
Robotics Ball Attachment Workcell for Ball Grid Array Semiconductor Packages;
用于集成电路球栅阵列（BGA）封装的全自动植球机的研制开发
13.
Finite-Element Simulation and Solder Joint Life Predictions for Chip Scale Ball Grid Array Size Package;
球栅阵列尺寸封装的有限元法模拟及焊点的寿命预测分析
14.
Light Source Analysis and Design of Machine-vision for Array Waveguide Bonding
阵列波导器件封装中机器视觉系统的光源分析与设计
15.
Surface-Enhanced Fluorescence Effect on Assembled Structure of Silver Nanoparticles
银纳米粒子组装阵列上表面增强荧光研究
16.
ceramic dual in-line package
陶瓷双列直插式封装
17.
Researches on Electrodeposition of Pd-Ag Alloy Nanowire Arrays on the Surface of Highly Oriented Pyrolytic Graphite;
高定向石墨表面电沉积钯银合金纳米线阵列研究
18.
Study of Inertial Step Response of a Novel MEMS Capacitive Accelerometer with Variable Areas in Low Vacuum
低真空封装的新型变电容面积MEMS惯性传感器阶跃响应特性分析