1.
Bumping Technology for MEMS Flip Chip Packaging;
MEMS封装中的倒装芯片凸点技术
2.
Investigation of Electromigration on Lead-Free Solder Bump in Flip Chip Packaging
倒装芯片技术中无铅凸点电迁移研究
3.
Research on Fabrication Technology of Bumps for Flip Chip
用于倒装芯片的晶片凸点制作工艺研究
4.
The Research on a Low Cost Flip Chip Bumping Process by Stencil Printing
一种低成本倒装芯片用印刷凸焊点技术的研究
5.
Flexible Bumping Technology and Applications in MEMS Flip Chip Packaging;
MEMS器件倒装芯片封装中的柔性化凸点制备技术及其应用
6.
program cam contact
程序鼓凸轮接点-卡片穿孔机上的
7.
Ground connection for an integrated chip. Dot can be shown or hidden.
集成芯片的接地。可显示或隐藏圆点。
8.
Design of SpaceWire Node Interface based on Single FPGA Chip
基于FPGA单芯片的SpaceWire节点接口设计
9.
The Circuit Design of LED Lattice Screen Driven by CH451
用CH451芯片驱动LED点阵屏的电路设计
10.
Integrated circuit design for solar cell maximum power point tracking
光伏电池最大功率点跟踪芯片的设计
11.
Hardware implementation of SHA-1 suiting to the wireless sensor network node chip
适用于WSN节点芯片的SHA-1硬件实现
12.
Research of locating bonding points automatically in chip bonding
芯片焊接中焊点自动定位技术的研究
13.
super chip
高密度芯片,超级芯片
14.
filing cord pique
横向灯芯布,横向凸条布
15.
mandrel-cambered bowl
中高轧辊,凸芯轧辊
16.
Switch point. Connect to input or output of integrated chip.
开关点与集成芯片的输入或输出端连接。
17.
Another advantage: The chip is an analog processor.
另一个优点是：该芯片是一种模拟处理器。
18.
The Application of Digital Recognize CMOS Chip on Motorcycle DC-CDI
数码识别芯片在摩托车数码点火器上的应用