1.
hybrid microassembly
混合集成电路微组装
2.
upside-down mounting
倒装法 -集成电路组装的
3.
Large Area Hybrid--An Advanced Microelectronic Packaging Concept
大面积混合电路——一种先进的微电子组装概念
4.
film mounted ic
膜载组装的集成电路
5.
passive hybrid film integrated circuit
无源混合膜集成电路
6.
tape bonded hybrid
带焊接的混合集成电路
7.
large scale hybrid integrated circuit
大规模混合集成电路
8.
This is called a hybrid integrated circuit .
这称为混合型集成电路。
9.
Reliability investigation on microvave HIC technologies under critical transition temperature of superconductor
超导温度下微波混合集成电路工艺可靠性初探
10.
large scale compound integration
大规模组合集成电路
11.
A New Conductor System Replaced Au with Cu Used in Hybrid Microwave Integrated Circuits
用于微波混合集成电路的新型以铜代金导电系统
12.
Case outlines for film integrated circuits and hybrid integrated circuits
GB/T15138-1994膜集成电路和混合集成电路外形尺寸
13.
Generic specification for film integrated circuits and hybrid film integrated circuits
GB/T8976-1996膜集成电路和混合膜集成电路总规范
14.
The Design of Mixed Signals Power Management Integrated Circuit XDJ6398;
数模混合电源管理集成电路XDJ6398的设计
15.
circuit, integrated hybrid, thin or thick film
混合集成电路,薄膜或厚膜的
16.
The Implementation of One-dimension Wavelet Transform Through Hybrid of Analog and Digital Circuit;
数模混合集成电路实现一维小波变换
17.
The Reliability-Analysis for HIC and Its Improvement;
厚膜混合集成电路可靠性分析与提高
18.
Research on EMI Shielding Inside Hybrid Intergrated Power Electronic Module
混合封装电力电子集成模块内电磁干扰的屏蔽