1.
					
							Reliability investigation on microvave HIC technologies under critical transition temperature of superconductor
						
						
						超导温度下微波混合集成电路工艺可靠性初探
					2.
					
							A New Conductor System Replaced Au with Cu Used in Hybrid Microwave Integrated Circuits
						
					
					
						
						
					
					
						用于微波混合集成电路的新型以铜代金导电系统
					3.
					
							hybrid microassembly
						
					
					
						
						
					
					
						混合集成电路微组装
					4.
					
							The Implementation of One-dimension Wavelet Transform Through Hybrid of Analog and Digital Circuit;
						
						
						数模混合集成电路实现一维小波变换
					5.
					
							active filter hybrid
						
					
					
						
						
					
					
						有源滤波器混合微电路
					6.
					
							passive hybrid film integrated circuit
						
					
					
						
						
					
					
						无源混合膜集成电路
					7.
					
							tape bonded hybrid
						
					
					
						
						
					
					
						带焊接的混合集成电路
					8.
					
							large scale hybrid integrated circuit
						
					
					
						
						
					
					
						大规模混合集成电路
					9.
					
							This is called a hybrid integrated circuit .
						
					
					
						
						
					
					
						这称为混合型集成电路。
					10.
					
							Case outlines for film integrated circuits and hybrid integrated circuits
						
					
					
						
						
					
					
						GB/T15138-1994膜集成电路和混合集成电路外形尺寸
					11.
					
							Generic specification for film integrated circuits and hybrid film integrated circuits
						
					
					
						
						
					
					
						GB/T8976-1996膜集成电路和混合膜集成电路总规范
					12.
					
							Analysis of LTCC Microwave Integrated Circuits Using PEEC Algorithm;
						
					
					
						
						
					
					
						LTCC微波集成电路的PEEC分析
					13.
					
							Study of Nonlinear Monolithic Microwave Integrated Circuits and Novel Planar Microwave Passive Circuits;
						
						
						非线性微波单片集成电路和新型平面微波无源电路研究
					14.
					
							The Design of Mixed Signals Power Management Integrated Circuit XDJ6398;
						
					
					
						
						
					
					
						数模混合电源管理集成电路XDJ6398的设计
					15.
					
							The Study on Numerical Simulation of Microwave and Millimeter-Wave 3-Dimensional Integrated Circuits;
						
						
						微波、毫米波三维空间集成电路的数值模拟研究
					16.
					
							The Simulation of Three-Dimensional Microwave & Millimeter-Wave Integrated Circuits;
						
					
					
						
						
					
					
						三维空间微波毫米波集成电路的仿真研究
					17.
					
							Manufacturing technologies of microwave PCB and resistance integration
						
					
					
						
						
					
					
						微波印制电路板制造工艺及其电阻集成
					18.
					
							circuit, integrated hybrid, thin or thick film
						
					
					
						
						
					
					
						混合集成电路,薄膜或厚膜的