1.
Influence of Silicon/Glass-ceramic Anodic Bonding Technology on Bonding Intensity
硅/微晶玻璃阳极键合工艺对键合强度的影响
2.
The bond in which the linkage pair of electrons are providedby one of the bonding atoms.
一个键合原子用以联结一对电子的键。
3.
glucosidic linkage
糖苷键[合],苷键[合]
4.
Modeling of the hybrid system with the HBG in MBD;
MBD中通过混合键合图对混合系统建模
5.
To deactivate the key combination for High Contrast, click Settings.
要停用“高对比”键组合，请单击“设置”。
6.
Influence of spline matching clearance on spline coupling failure;
试析配合间隙对花键联结失败的影响
7.
Effect of Bonding Materials on Parameters of 1 W White-LED
键合材料对1W白光LED性能的影响
8.
Normally, we use the word bond to describe the linkage between a particular pair of atoms.
通常我们用键这个词来描述指定的一对原子之间的键合。
9.
Application of Iron Complexes Supported by Trimethylphosphine in C-Cl and C-F Bond Activation
三甲基膦支持的铁配合物对C-Cl键、C-F键的活化
10.
System Critical objects such as %1 cannot be the the source for merge operations.
系统关键对象(例如 %1)不能是合并操作的源对象。
11.
The Study of the Relative Theory Effect on the Function of the Non-Bond of Compounds Containing Iodine
相对论效应对含碘复合物非键作用的影响研究
12.
Influence of Temperature on Alignment Accuracy in the Thermosonic Flip-chip Bonding
热超声倒装键合中温度对对准精度的影响
13.
Study on Absorption Behaviour of Protein with Silica Gel Bonded by Porphyrin Reagents
卟啉试剂键合硅胶对蛋白质吸附行为研究
14.
Interfacial Reactions and Alignment for Fiber Bonding by Laser Soldering;
光纤激光钎焊键合过程中界面反应及对准研究
15.
Power Bond Graph Theory Study and Its Application in Thermal System;
功率键合图理论及其在热工对象上的应用研究
16.
Effect of Shading on Camptothecin Biosynthetic Key Enzymes TSB and TDC;
遮荫对喜树碱生物合成关键酶TSB和TDC的影响
17.
Implication of Hydrogen Bond on the Properties and Structures of Nitrogenous Organic Compound;
氢键对含氮有机化合物性质和结构的影响
18.
Impact of the chip bonding layer material on the thermal resistance of power LED
芯片键合层材料对功率型LED热阻的影响