1.
The Reliability-Analysis for HIC and Its Improvement;
厚膜混合集成电路可靠性分析与提高
2.
Application of Virtual Instruments Technique in HIC Testing;
虚拟仪器技术在厚膜混合集成电路测试中应用
3.
The Application of Infrared Imaging Technology on The Thermal Design of Thick Film Hybrid IC
热成像技术在厚膜混合集成电路热设计中的应用
4.
circuit, integrated hybrid, thin or thick film
混合集成电路,薄膜或厚膜的
5.
passive hybrid film integrated circuit
无源混合膜集成电路
6.
Development of 64-route Thick Film Hybrid Integrated Switching Module;
64路厚膜混合集成开关模块的研制
7.
Generic specification for film integrated circuits and hybrid film integrated circuits
GB/T8976-1996膜集成电路和混合膜集成电路总规范
8.
Case outlines for film integrated circuits and hybrid integrated circuits
GB/T15138-1994膜集成电路和混合集成电路外形尺寸
9.
Thick-film hybrid integrated capacitive accelerometer
基于厚膜混合集成的电容式加速度传感器
10.
Blank detail specification for film integrated circuits and hybrid film integrated circuits on the basis of the qualification approval procedure
GB/T13062-1991膜集成电路和混合膜集成电路空白详细规范(可供认证用)
11.
Sectional specification for film integrated circuits and hybrid film integrated circuits on the basis of the capability approval procedures
GB/T16465-1996膜集成电路和混合膜集成电路分规范（采用能力批准程序）
12.
Thick Film Integration Package Technology for Pressure Sensor
压力传感器的厚膜混合集成封装技术
13.
Important Technique Problems in Silk Screen Printing for Thick Film Integrated Circuits
厚膜集成电路网印应注意的技术问题
14.
tape bonded hybrid
带焊接的混合集成电路
15.
hybrid microassembly
混合集成电路微组装
16.
large scale hybrid integrated circuit
大规模混合集成电路
17.
This is called a hybrid integrated circuit .
这称为混合型集成电路。
18.
Blank detail specification for film integrated circuits and hybrid film integrated circuits on the basis of the capability approval procedures
GB/T16466-1996膜集成电路和混合膜集成电路空白详细规范(采用能力批准程序)