1.
Study on Thermal Placement Optimization of Stacked 3D-MCM Based on Thermal Superposition Model
基于热叠加模型的叠层3D多芯片组件芯片热布局优化研究
2.
Analysis of the Interconnect in Microwave Multi-chip Module by Parallel FDTD Technique;
并行FDTD技术分析微波多芯片组件的互连效应
3.
Warpage of Three-Dimensional Multi-Chip Module Based on Embedded Substrate
基于埋置式基板的三维多芯片组件的翘曲研究
4.
Performance of a silicon-based embedded MMCM package
一种硅埋置型微波多芯片组件封装的电性能
5.
Characteristics simulation of MEMS packaging using multichip modules technology
基于微机械系统的多芯片组件封装和特性模拟(英文)
6.
Design and transmission characteristics simulation in MCM placement and routing
多芯片组件高速电路布局布线设计及信号传输特性仿真
7.
Finite Element Simulation of Reliability and Life Prediction on Solder Joint of MCM;
多芯片组件（MCM）焊点可靠性的有限元模拟与寿命的预测
8.
Multi-chip Array Combination White Light LED Seal Research
多芯片阵列组合白光LED封装研究
9.
Development of Recognized Software on Multi-tumor Protein Chip Analysis System V1.0
多肿瘤蛋白芯片肿瘤判别软件的研制
10.
Design and Implementation of FPGA Hardware Emulation Platform and MIPS Chipset;
FPGA硬件仿真平台和MIPS芯片组的设计与实现
11.
Development of a Miniature T/R Front-end Using Microwave Multi-Chip Module Technology
基于多芯片组装技术的小型微波收发前端研制
12.
Construct cell immuno-chip with tissue microarray technique
应用组织芯片技术构建细胞免疫芯片
13.
Chipsets are key components in computers and other electronic devices that act as nervous systems channelling data between CPUs and other chips.
芯片组是电脑和其它电子装置的关键部件，是CPU和其它芯片之间数据传输的中枢系统。
14.
SOAC System On a Chip
系统集成多功能芯片
15.
A unit composed of an assemblage of pieces welded together.
焊件由许多片焊接在一起的金属片组成的元件
16.
In 1971, large scale integration (LSI) was used to put thousands of gates on a chip.
1971年，在一块芯片上集成了上千个组件的大规模集成电路（lsi）问世。
17.
Simulation Method in Single Chip Systems_5. An Example for Designing Component Simulation Softwaer
芯片模拟仿真方法——5.组合模拟仿真软件设计实例
18.
DNA Microarray-based Transcriptomics Study of Yersinia Pestis in Response to Various Conditions;
基于DNA芯片技术鼠疫耶尔森氏菌在不同条件下的转录组学研究