1.
The Structure and Properties of Al/SiCp Composites Preparated by Pressureless Infiltration for Electronic Packaging;
无压浸渗制备Al/SiCp电子封装材料的结构与性能
2.
A Study on the Bending Strength and Wear Resistance of SiC/Al Composites by Pressureless Infiltration;
无压浸渗法制备SiC/Al复合材料强度和耐磨性的研究
3.
Pressureless Infiltration of SiCp/Al Electronic Packaging Materials with Particles of Bimodal Size Distribution;
无压浸渗制备双尺寸颗粒SiCp/Al电子封装材料的研究
4.
Study on Process and Thermal Properties of Si_P/Al Composites Prepared by Pressureless Infiltration;
高含量Si_P/Al热控制材料的无压浸渗工艺及热性能研究
5.
Fabrication and Properties of β-SiCp/Al Electronic Packaging Material by Pressureless Infiltration;
无压浸渗法制备β-SiCp/Al电子封装材料工艺与性能研究
6.
Study on Technology and Properties of Al_2O_(3f)/AZ91D Composite Prepared by Pressrueless Infiltration Method;
无压浸渗法制备Al_2O_（3f）/AZ91D复合材料工艺及性能研究
7.
Compatibility of SiC_p/Al Composites with Titanium Alloy Integrated Synchronously by Pressureless Infiltration Technique
Ti合金与SiC_p/Al复合材料在无压浸渗同步复合过程中的相容性
8.
Presureless Infiltration and Thermal-properties of SiC Porous Ceramics Reinforced Al Composites for Electronic Packaging
SiC/Al基电子封装复合材料的无压浸渗法制备与热性能研究
9.
The structure/ function integrating aluminium matrix composite was prepared by pressureless infiltration( a new casting technology) and the properties of the composite were tested in this paper.
采用新型铸造-无压浸渗法制备了结构/能一体化铝基复合材料,并对该复合材料进行了性能测试。
10.
The interfacial reactions enhance the wettability and promote the spontaneous infiltration process.
界面反应的存在提高了润湿性,促进了无压自发浸渗。
11.
Effect of the Reactive Additions on the SiCp/Al Composites Fabricated by the Pressureless Infiltration Technique;
活性剂对无压自浸渗法制备SiCp/Al复合材料的影响
12.
The FEM Simulation and Pressure Infiltration of Al_2O_3p/ZL104 Composites;
压力浸渗制备Al_2O_3p/ZL104复合材料及有限元模拟
13.
Fabrication and Properties of SiCp/Al Electronic Packaging Housing by Gas Pressure Infiltration;
气压浸渗SiCp/Al电子封装外壳的制备与性能
14.
The FEM Simulation of the Liquid Infiltration-Extrusion Process Including Damage for Composites;
复合材料液态浸渗挤压有限元模拟及损伤研究
15.
The FEM Simulation of the Liquid Infiltration-Extrusion Process for Composites;
复合材料液态浸渗挤压过程的有限元模拟
16.
Research on the FEM Simulation of the Liquid Infiltration-Extrusion Process for Fabricating MMC;
液态浸渗挤压复合材料过程的有限元模拟
17.
Investigation on Al/SiCp Electronic Packaging Materials Fabricated by Gas Pressure Infiltrating Processes;
气压浸渗法制备Al/SiCp电子封装材料的研究
18.
Manufacturing TiC/Ni_3Al Composites by Using Pressureless Melt Infiltration Processing
无压熔渗法制备TiC/Ni_3Al复合材料的渗入工艺研究