1.
The Study of Pulse Electroplating of Au-Sn Bumps
脉冲电镀法制备Au-Sn凸点的研究
2.
The Study of Sequential Electroplating Au/Sn Bumps for FC-LEDs;
分步电镀法制备FC-LEDs用Au/Sn凸点的研究
3.
Fabrication of Gold-Tin Solder and Packaging Study on High Power Semiconductor Lasers;
高功率半导体激光器Au-Sn焊料制备与焊装工艺研究
4.
The Synthesis of Luminescent CdTe Quantum Dots and Its Interaction with Au(Ⅲ)
CdTe量子点的制备及其与Au(Ⅲ)的作用
5.
Molecular dynamics simulation of the melting points of Au Nana-clusters
Au纳米团簇熔点的分子动力学模拟
6.
Study on the Non-eutectic Sn-Bi Solders with Low Melting Point;
Sn-Bi系低熔点非共晶无铅焊料的研究
7.
Investigation on Low Temperature Sn-Zn Base Lead-Free Solder Alloys
低熔点Sn-Zn系无铅钎料的研究
8.
The Study of Sn-3.0Ag-0.5Cu-XNi Lead-free Solder and Joint Point Microstructure and Property
Sn-3.0Ag-0.5Cu-XNi钎料及焊点组织和性能研究
9.
Properties of Sn-3.0Ag-0.5Cu-xNi lead-free solders and soldering joints
Sn-3.0Ag-0.5Cu-xNi无铅焊料及焊点的性能
10.
Wettability of Sn-9Zn-xAg lead-free solder and mechanical properties of soldered joints
Sn-9Zn-xAg无铅钎料润湿性能及焊点力学性能
11.
triangular asperities technique
三角形凸点密封技术
12.
a convex shape that narrows toward a point.
向一个端点尖起的凸形。
13.
Wet UBM Etching and Bump Undercut Control
凸点下金属层湿法刻蚀与凸点底切的控制
14.
Study on the Preparation, Characterization and Supports of Au-Pd Bimetallic Catalysts for Thiophene Hydrodesulfurization;
Au-Pd双金属加氢脱硫催化剂的制备、特点及其载体的研究
15.
The Application of Double DNI Inter-node Ring Using Double AU to Chieve in the SDH Local Network;
利用双AU实现DNI双节点跨环保护在SDH本地传输网中的应用
16.
Influence of Phosphorus on Reliability of Interface between Au/Ni/Cu Pad and SnAgCu Solder Joint
P对Au/Ni/Cu焊盘与SnAgCu焊点焊接界面可靠性的影响
17.
As the camshaft rotates, the lobe, or high spot of the cam, pushes against parts connected to the stem of the valve.
当凸轮轴旋转时，凸轮凸起的或者高点的位置，推动气门座。
18.
Investigation on Fabrication of a Low Melting Point Lead-free Sn-Bi-X Solders and Lead-free Soldering Process;
低熔点无铅焊料Sn-Bi-X的研制与无铅焊接工艺研究