1.
Materials and Process Techniques of Copper Infiltrated Tungsten for Thrust Vector Jet Vane of Airborne Missile
空空导弹推矢燃气舵用钨渗铜材料与工艺
2.
Cobalt-tungsten electrodeposit as copper barrier was presented in the paper.
本文提出以电镀钴钨二元合金镀层作为防铜渗层。
3.
Meanwhile, properties of cobalt-tungsten, nickel, cobalt deposit as copper barrier at temperature between400℃ and800℃ were compared.
同时比较了在400～00℃，钴钨合金镀层与镍层、层的防铜渗能力。
4.
Results showed cobalt-tungsten deposit as copper barrier at temperature of500℃ and below was superior to nickel, cobalt deposit.
当温度低于500℃，钴钨合金镀层的防铜渗性能优于后二者。
5.
Natural Resources: Coal, gold, tungsten, lead, copper. uranium.
自然资源：煤、金、钨、铅、铜、铀。
6.
Research on Influence of Milling Techniques on Tungsten-copper Composite Powder and Its Alloy;
球磨工艺对钨铜复合粉及钨铜合金影响研究
7.
The Research on Brazing Process betweeen W-Cu Heat Sink with Plated Nickel and Silver-copper Solder
镀镍钨铜与银铜焊料钎焊工艺的研究
8.
Investigation on Brass/W-Cu Alloy Functionally Graded Material(FGM) by Infiltration-Diffusion Method
熔铸-扩散法制备黄铜/钨铜功能梯度材料的研究
9.
The thin wire is not made of copper; it is made of tungsten.
细导线并不是由铜制的，而是由钨制的。
10.
STUDY OF MECHANICALLY ALLOYED Cu W SHAPEDCHARGE LINER MATERIALS
机械合金化铜-钨药型罩材料的研究
11.
Studies of the Electrochemical Behavior of Copper, Tungsten, Lipoic Acid and Its Application;
铜、钨、硫辛酸的电化学行为研究和应用
12.
The Study of Vacuum Electrical Performance of New-style WCu Contact Materials;
新型钨铜触头材料真空电性能的研究
13.
Preparation and Properties of High Density W-Cu Composites;
高比重钨—铜复合材料制备及性能研究
14.
Reason for Gold and Copper Discovery in Mountain with Tungsten and Tin Discovery on Plain
“上山”找金铜,“下山”找钨锡及其理由
15.
Study on electrodeposition process and properties of copper–tungsten composite coating
铜-钨复合镀层电沉积工艺及其性能
16.
Preparation and Formability of Tungsten-Copper EFP Liner
钨铜EFP药型罩的制备及成形性能
17.
Study on Technics of Copper Aluminizing and Corrosion-resistant of Aluminizing Copper;
纯铜渗铝工艺及渗铝铜耐蚀性能的研究
18.
Tungsten alloys are materials with a high tungsten content and low amounts of NiFe or NiCu.
钨基高比重合金是钨中加入少量的镍铁或镍铜烧结而成。