1.
The Bonding Structure Optimizing Design and Experimental Study for Die Bonder;
粘片机焊头机构优化设计及实验研究
2.
Motion Modeling and Simulation Technology of Bonding Head Mechanisms
焊头机构运动建模与仿真技术的研究
3.
Moving Stiffness Analysis on the Parallel Bonding Mechanism of IC Chip Die;
IC芯片粘片机并联焊头机构的动刚度分析
4.
Design and Optimization for the Bonding Head with Parallel Mechanism Based on IC Encapsulation;
基于IC封装的并联焊头机构的设计与优化
5.
Inspection of Positioning and Moving Accuracy of the Bonding Machine of Planar Parallel Mechanism Based on Machine Vision;
基于机器视觉的并联焊头机构定位和运动精度的检测
6.
Analysis of Kinematics and Dynamics and Experimental Research for Parallel Bonder of IC Die Bonder;
IC芯片粘片机并联焊头机构的运动学动力学分析及实验研究
7.
Trajectory Planning and Motion Control Base on the IC Chip Die-bonder with Parallel Mechanism;
基于IC封装的并联焊头机构的轨迹规划及其运动控制
8.
Optimize and Design for the Four-Link Structure of the Die Bonder and Motion Simulation Based on the CosmosMotion
基于CosmosMotion的焊头四连杆机构优化设计
9.
Research and Development of a New Kind of Head Structure and Motion Mechanism
新型焊头结构与运动机构的研究及开发
10.
twin-head tandem arc-welding machine
双头串联电弧自焊机
11.
Microstructural Characteristics and Transformation Mechanism in Dissimilar Metal Welds of Composite Parts;
复合零部件异种金属焊接接头显微结构特征及其转变机理研究
12.
The strip goes further after croping through next pinch rolls and stops waiting for welding.
带钢齐头剪切后经夹送辊送至焊机等待焊接。
13.
Study of Action Mechanism of Fluxes and Microstructure and Properties of Joints in ZA Alloy TIG Welding;
ZA合金TIG焊焊剂作用机理及接头组织性能研究
14.
Basic Fatigue Curves of Butt Welded Joints in Two Kinds of Structural Steel Plate
两种结构钢板焊接头的基础疲劳曲线
15.
Microstructures and Mechanical Properties of the Welded Joints in Bogie Frame;
转向架构架焊接接头组织与性能研究
16.
Research for the J_(IC) Test Method of Construct Steel Welded Joint;
结构钢焊接接头的J_（IC）测试方法研究
17.
The Research and Development of Power Supply of Endless Rolling Welding Machine;
无头轧制专用焊机电源的研究与开发
18.
Study on the Process and Mechanism of Diffusion Welding between Contact and Solder;
触头焊料扩散连接的工艺及机理研究