1.
Shape Optimization for Hydrodynamic Journal Bearings Based on General Film Thickness Equation
采用通用膜厚方程的动压径向轴承形状优化
2.
Micrometer on instrument that can be used to measure thickness. Typically used to measure the dry film thickness of paint and the thickness of metal strip.
千分尺—用来测量厚度的工具。通常用作测量涂膜的干膜厚度和带钢的厚度。
3.
Application and Comparison Analysis of Calculating Methods of Composite Geomembrane Thickness
复合土工膜厚度计算方法的应用比较分析
4.
The Advanced Process Method of Double Pitch Worm in Engine Lathe
在普通车床上加工双导程渐厚蜗杆的新方法
5.
Through the careful research and analysis on threading process in a cold continuous rolling mill, we proposed a new threading technology satisfying the mill, namely threading with a supposed output thickness that is thicker than the true one.
通过对某钢厂冷连轧机穿带过程的深入研究,提出了在该轧机上应用“厚带头”穿带工艺的新方案。
6.
By the integral to boundary layer thickness and relative conditions, the momentum integral equation of boundary layer is obtained.
通过对边界层厚度的积分并利用相关条件，得到了边界层动量积分方程。
7.
graphic-art technique
图形法-厚膜电路工艺用
8.
Test methods of precious metal pastes used for thick film microelectronics--Determination of sheet resistance
GB/T17473.3-1998厚膜微电子技术用贵金属浆料测试方法方阻测定
9.
Simulated Studies to Measure the Grease Stain Thickness in Oil Pipeline Using by MCNP
利用MCNP程序模拟检测管道油垢厚度方法探究
10.
Test methods of precious metal pastes used for thick film microelectronics--Determination of adhesion
GB/T17473.4-1998厚膜微电子技术用贵金属浆料测试方法附着力测定
11.
Test methods of precious metal pastes used for thick film microelectronics--Determination of viscosity
GB/T17473.5-1998厚膜微电子技术用贵金属浆料测试方法粘度测定
12.
Test methods of precious metal pastes used for thick film microelectronics--Determination of fineness
GB/T17473.2-1998厚膜微电子技术用贵金属浆料测试方法细度测定
13.
Test methods of precious metal pastes used for thick film microelectronics--Determination of solids content
GB/T17473.1-1998厚膜微电子技术用贵金属浆料测试方法固体含量测定
14.
Test methods of precious metal pastes used for thick-film microelectronics--Determination of resolution
GB/T17473.6-1998厚膜微电子技术用贵金属浆料测试方法分辨率测定
15.
Test methods of precious metal pastes used for thick-film microelectronics--Test of solderability and solderleaching resistance
GB/T17473.7-1998厚膜微电子技术用贵金属浆料测试方法可焊性、耐焊性试验
16.
This kind of film is twice thinner than ordinary paper.
这种薄膜的厚度只及普通纸的一半。
17.
Calculation of Transversal Slab Thickness During Plate Rolling
中厚板轧制过程横向厚度的计算方法
18.
KMC technique of computer simulation of thin-film growth;
用计算机模拟薄膜生长过程的KMC方法