1) SnPb eutectic solder
SnPb共晶钎料
1.
Reaction kinetics between SnPb eutectic solder and Au/Ni/Cu pad during laser reflow;
激光加热条件下SnPb共晶钎料与Au/Ni/Cu焊盘界面反应动力学
2.
SnPb eutectic solder reflow on BGA pad metallized with Au/Ni to form solder bump with induction self excite heat under alternate electromagnetic radiation is performed, and impacts of induction self excite heat and solid state aging on interfacial reaction between SnPb eutectic solder and Au/Ni metallization are investigated.
进行了交变电磁辐射下附Au/Ni镀层BGA焊盘上SnPb共晶钎料球感应自发热重熔形成钎料凸台的实验,并分析了感应自发热重熔以及固态老化对SnPb共晶钎料与Au/Ni镀层焊盘界面反应的影响。
2) SnPb soft solder
SnPb软钎料
1.
Aimed at the problem of fine solder in large power devices,the microstructure and components of SnPb soft solder of device are analyzed and the failure modes for polishing are documented.
针对大面积功率器件软钎料的失效问题,运用扫描电子显微镜(SEM)分析了SnPb软钎料的微观结构并运用能谱仪对其进行成分分析,找出了失效的主要原因:对软钎料进行刚玉抛光后,未能将残留在软钎料内的Al2O3成分完全去除,以至于器件的可焊性变差。
3) eutectic SnPb solder
SnPb共晶焊料合金
4) eutectic solder
共晶钎料
1.
Shear strength of BGA packaging device joints with Sn-Pb eutectic solder were studied in the paper using Micro-joints Strength Tester,and compared BGA joints shear strength with different diameters.
采用微焊点强度测试仪研究了Sn-Pb共晶钎料BGA(球栅阵列封装技术)封装器件焊点的抗剪强度,并对不同直径的BGA球焊点的抗剪强度进行了比较。
2.
The tensile strength of soldered joints of QFP with pure lead is higher than that of eutectic solder and as well and as higher .
研究结果表明,在相同的钎料成分下,焊脚间距越大,所需的抗拉力越大,抗拉强度越高;共晶钎料QFP焊点的抗拉强度比纯铅的抗拉强度低,QFP焊点的结合强度比钎料自身的抗拉强度高。
5) eutectic SnBi solder
共晶SnBi钎料
6) Sn-9Zn eutectic solder
Sn-9Zn共晶钎料
1.
The element of In was added to improve the soderability of Sn-9Zn eutectic solder.
Sn-9Zn共晶钎料可以用于钎焊钎焊性极差的铸造铝合金ZL102,在Sn-9Zn钎料的基础上添加In元素,以提高钎料对ZL102合金的润湿。
补充资料：共晶共沉淀
分子式：
CAS号：
性质：共沉淀法之一，指无法结晶的微量物质与常量物质产生共结晶沉淀而被载带出来。
CAS号：
性质：共沉淀法之一，指无法结晶的微量物质与常量物质产生共结晶沉淀而被载带出来。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条